参数资料
型号: CPC1967J
厂商: IXYS Integrated Circuits Division
文件页数: 1/7页
文件大小: 0K
描述: RELAY 400VAC/DC 1.35A I4-PAC
产品目录绘图: CPC19xxJ Series Circuit
标准包装: 25
系列: CPC, OptoMOS®
电路: SPST-NO(1 Form A)
输出类型: AC,DC
导通状态电阻: 850 毫欧
负载电流: 1.35A
输入电压: 1.2VDC
电压 - 负载: 0 ~ 400 V
安装类型: 通孔
端接类型: PC 引脚
封装/外壳: i4-Pac?-4,隔离
供应商设备封装: i4-PAC?
包装: 管件
继电器类型: 继电器
产品目录页面: 2629 (CN2011-ZH PDF)
其它名称: CLA282
CPC1967
i4-PAC? Power Relay
I NTEGRATED C IRCUITS D IVISION
Characteristics
Description
Parameter
Blocking Voltage
Load Current, T A =25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
R ? JC
Rating
400
3.35
1.35
0.85
0.35
Units
V P
A rms / A DC
?
°C/W
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS? technology, reliability
and compact size to a new family of high power Solid
State Relays.
As part of this family, the CPC1967 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.35A rms continuous load current with a
5°C/W heat sink.
Features
? 3.35A rms Load Current with 5°C/W Heat Sink
? Low 0.85 ? On-Resistance
? 400V P Blocking Voltage
The CPC1967 employs optically coupled MOSFET
technology to provide 2500V rms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED. The combination
?
?
?
?
?
?
?
2500V rms Input/Output Isolation
Low Thermal Resistance (0.35 °C/W)
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
of low on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
Applications
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
?
?
?
?
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
? Multiplexers
? Data Acquisition
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V rms isolation,
but also very low thermal resistance (0.35 °C/W).
Ordering Information
? Electronic Switching
? I/O Subsystems
? Meters (Watt-Hour, Water, Gas)
? Transportation Equipment
Part
CPC1967J
Description
i4-PAC Package (25 per tube)
? Aerospace/Defense
Approvals
? UL 508 Recognized Component: File E69938
Switching Characteristics
Form-A
Pin Configuration
I F
90%
e 3
I LOAD
t on
10%
t off
DS-CPC1967-R06
www.ixysic.com
1
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CPC1972G 功能描述:三极与 SCR 输出光电耦合器 Single Pole Power SIP RoHS:否 制造商:Vishay Semiconductors 输出设备:PhotoTriac 每芯片的通道数量: 绝缘电压:3750 Vrms 正向电流:10 mA 正向电压:1.2 V 最大触发电流:10 mA 关断状态下输出电压-VDRM:600 V 最大连续输出电流: 零交叉电路: 封装:Reel
CPC1972GS 功能描述:三极与 SCR 输出光电耦合器 Single Pole Power SIP RoHS:否 制造商:Vishay Semiconductors 输出设备:PhotoTriac 每芯片的通道数量: 绝缘电压:3750 Vrms 正向电流:10 mA 正向电压:1.2 V 最大触发电流:10 mA 关断状态下输出电压-VDRM:600 V 最大连续输出电流: 零交叉电路: 封装:Reel