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参数资料
| 型号： | CPC5611ATR |
| 厂商： | CLARE INC |
| 元件分类： | 调制器/解调器 |
| 中文描述： | MODEM-SUPPORT CIRCUIT, PDSO32 |
| 封装： | PLASTIC, SOIC-32 |
| 文件页数： | 10/18页 |
| 文件大小： | 743K |
| 代理商： | CPC5611ATR |
7.2 Tape and Reel Packaging
Figure 19. Tape and Reel Dimensions
7.3 Soldering
7.3.1 Moisture Reflow Sensitivity
Clare has characterized the moisture reflow sensitivity
of LITELINK using IPC/JEDEC standard J-STD-020A.
Moisture uptake from atmospheric humidity occurs by
diffusion. During the solder reflow process, in which
the component is attached to the PCB, the whole body
of the component is exposed to high process tempera-
tures. The combination of moisture uptake and high
reflow soldering temperatures may lead to moisture
induced delamination and cracking of the component.
To prevent this, this component must be handled in
accordance with IPC/JEDEC standard J-STD-020A
per the labeled moisture sensitivity level (MSL), level
3.
7.3.2 Reflow Profile
The maximum ramp rates, dwell times, and tempera-
tures of the assembly reflow profile should not exceed
those specified in IPC/JEDEC standard J-STD-020A,
which were used to determine the moisture sensitivity
level of this component.
7.4 Washing
Clare does not recommend ultrasonic cleaning of this
part.
Dimensions
mm
(inches)
330.2 DIA.
(13.00)
Top Cover
Tape Thickness
.102 MAX.
(.004)
12.090
(.476)
Embossed Carrier
Embossment
6.731 MAX.
(.265)
.406 MAX.
(.016)
Top Cover
Tape
3.20
(.126)
2.70
(.106)
7.493 ± .102
(.295 ± .004)
1.753 ± .102
(.069 ± .004)
2.007 ± .102
(.079 ± .004)
1.498 ±.102
(.059 ± .004)
3.987 ± .102
(.157 ±.004)
Feed Direction
11.989 ± .102
(.472 ± .004)
10.897 ± .025
(.429 ± .001)
1.549 ± .102
(.061 ± .004)
10.693 ± .025
(.421 ± .001)
16.002 ± .305
(.630 ± .012)
.050R TYP.
For additional information please visit www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC5610/CPC5611-R9.0
Copyright 2002, Clare, Inc.
All rights reserved. Printed in USA.
6/27/2002
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CPC5620 | 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:LITELINK III Phone Line Interface IC (DAA) |
| CPC5620_1 | 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:LITELINK? III Phone Line Interface IC (DAA) |
| CPC5620A | 功能描述:固态继电器-PCB安装 LITELINK III, Half-wave Ring Detect RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT |
| CPC5620ATR | 功能描述:固态继电器-PCB安装 LITELINK III, Half-wave Ring Detect, T/R RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT |
| CPC5621 | 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:LITELINK? III Phone Line Interface IC (DAA) |
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