参数资料
型号: CPC7584BA
厂商: CLARE INC
元件分类: 通信及网络
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO16
封装: SOIC-16
文件页数: 7/16页
文件大小: 320K
代理商: CPC7584BA
CPC7584
Rev. B
www.clare.com
15
Preliminar
y
3.2 Printed-Circuit Board Layout
3.2.1 SOIC
3.2.2 MLP
3.3 Tape and Reel Packaging
3.3.1 SOIC
3.4 Soldering
3.4.1 Moisture Reflow Sensitivity
Clare has characterized the moisture reflow sensitivity
of LCAS products using IPC/JEDEC standard
J-STD-020A. Moisture uptake from atmospheric
humidity occurs by diffusion. During the solder reflow
process, in which the component is attached to the
PCB, the whole body of the component is exposed to
high process temperatures. The combination of
moisture uptake and high reflow soldering
PC Board Pattern
(Top View)
1.193
(.047)
9.728
± .051
(.383
± .002)
.787
(.031)
1.270
(.050)
0.65
6.1
0.38
0.65
0.38
0.47
0.66
5.75
6.13
0.75 on center
5.35 on center
Detail A
All dimensions in mm
Not drawn to scale
B0
16.00
7.50
R = .50
2.30
K0
K1
1.30
6.80
3.00
A0
2.00
4.00
2.00
1.50
12.00
6.50
2.70
A0 =
B0 =
K0 =
K1 =
NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS AND CARRY TOLERANCES OF EIA
STANDARD 481-2. 2. THE TAPE COMPLIES WITH ALL "NOTES" FOR CONSTANT DIMENSIONS
LISTED ON PAGE 5 OF EIA-481-2.
6.5 mm
10.3 mm
2.3 mm
2.7 mm
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