参数资料
型号: CPC7591BCTR
厂商: CLARE INC
元件分类: 通信及网络
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO16
封装: SOIC-16
文件页数: 9/17页
文件大小: 391K
代理商: CPC7591BCTR
CPC7591
R01
www.clare.com
17
3.3 Tape and Reel Packaging
3.3.1 SOIC
3.3.2 MLP
MLP tape and reel drawing specifications not available
at time of documentation release. Please contact the
factory for details.
3.4 Soldering
3.4.1 Moisture Reflow Sensitivity
Clare has characterized the moisture reflow sensitivity
of LCAS products using IPC/JEDEC standard
J-STD-020A. Moisture uptake from atmospheric
humidity occurs by diffusion. During the solder reflow
process, in which the component is attached to the
PCB, the whole body of the component is exposed to
high process temperatures. The combination of
moisture uptake and high reflow soldering
temperatures may lead to moisture induced
delamination and cracking of the component. To
prevent this, this component must be handled in
accordance with IPC/JEDEC standard J-STD-020A
per the labelled moisture sensitivity level (MSL),
level 1 for the SOIC package, and level 3 for the MLP
package.
3.4.2 Reflow Profile
The maximum ramp rates, dwell times, and
temperatures of the assembly reflow profile should not
exceed those specified in IPC standard IPC-9502,
table 2. Soldering processes are limited to 220
°C
component body temperature.
3.5 Washing
Clare does not recommend ultrasonic cleaning of
LCAS parts.
Top Cover
Tape Thickness
0.102 MAX
(0.004 MAX)
330.2 DIA.
(13.00 DIA)
Embossed Carrier
Embossment
K0=2.70 0.15
(0.106 0.01)
+
K1=2.30 0.15
(0.0906 0.01)
+
P=12.00
(0.47)
A0=6.5 0.15
(0.256 0.01)
+
B0=10.30 0.15
(0.4055 0.01)
+
W=16.00 0.3
(0.630 0.01)
+
For additional information please visit www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC7591-R 01
Copyright 2004, Clare, Inc.
All rights reserved. Printed in USA.
4/27/2004
相关PDF资料
PDF描述
CPC7591MCTR
CPC7595ZC
CPC7595BBTR
CPC7595ZCTR
CPC7595BC
相关代理商/技术参数
参数描述
CPC7591MA 功能描述:固态继电器-PCB安装 4-pole MLP LCAS RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
CPC7591MATR 功能描述:固态继电器-PCB安装 4-pole MLP LCAS, T/R RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
CPC7591MB 功能描述:固态继电器-PCB安装 4-pole, no SCR, MLP LCAS RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
CPC7591MBTR 功能描述:固态继电器-PCB安装 4-pole, no SCR, MLP LCAS, T/R RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
CPC7591MC 功能描述:固态继电器-PCB安装 4-pole, high hold current, MLP LCAS RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT