参数资料
型号: CPC7591MC
厂商: CLARE INC
元件分类: 通信及网络
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO16
封装: MLP-16
文件页数: 8/17页
文件大小: 391K
代理商: CPC7591MC
CPC7591
16
www.clare.com
R01
3.2 Printed-Circuit Board Layout
3.2.1 SOIC
3.2.2 MLP
NOTE: For optimum solder joint size, MLP package
printed-circuit board pads should extend no more than
0.05 mm past the chip post on the short sides, and no
more than 0.025 mm past the chip posts on the long
sides.
As the metallic pad on the bottom of the MLP package
is connected to the substrate of the die, Clare
recommends that no printed circuit board traces or
vias be placed under this area to prevent unintentional
shorts.
(Top View)
PC Board Pattern
1.193
(0.047)
9.728 ± 0.051
(0.383 ± 0.002)
0.787
(0.031)
1.270
(0.050)
DIMENSIONS
INCHES
(MM)
1.10
6.65
0.45
1.10
0.45
0.73
0.70
5.60
6.05
0.80 on center
5.45 on center
Detail A
All dimensions in mm
Not drawn to scale
相关PDF资料
PDF描述
CPC7591BCTR
CPC7591MCTR
CPC7595ZC
CPC7595BBTR
CPC7595ZCTR
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