参数资料
型号: CPC7592MC
厂商: CLARE INC
元件分类: 通信及网络
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO16
封装: ROHS COMPLIANT, DFN-16
文件页数: 10/20页
文件大小: 588K
代理商: CPC7592MC
CPC7592
18
www.clare.com
R03
3.1.2 16-Pin DFN
3.2 Printed-Circuit Board Layout
3.2.1 16-Pin SOIC
3.2.2 16-Pin DFN
NOTE: As the metallic pad on the bottom of the DFN
package is connected to the substrate of the die, Clare
recommends that no printed circuit board traces or
vias be placed under this area to maintain minimum
creepage and clearance values.
EXPOSED
METALLIC PAD
7.00 ± 0.25
(0.276 ± 0.01)
6.00 ± 0.25
(0.236 ± 0.01)
INDEX AREA
TOP VIEW
SEATING
PLANE
SIDE VIEW
0.90 ± 0.10
(0.035 ± 0.004)
0.30 ± 0.05
(0.012 ± 0.002)
0.02, + 0.03, - 0.02
(0.0008, + 0.0012, - 0.0008)
0.20
(0.008)
4.25 ± 0.05
(0.167 ± 0.002)
0.55 ± 0.10
(0.022 ± 0.004)
6.00 ± 0.05
(0.236 ± 0.002)
BOTTOM VIEW
Dimensions
mm
(inch)
Terminal Tip
0.80
(0.032)
16
1
2.00
(0.079)
1.27
(0.050)
mm
(inches)
DIMENSIONS
9.40
(0.370)
0.60
(0.024)
DIMENSIONS
mm
(inches)
5.80
(0.228)
0.35
(0.014)
1.05
(0.041)
0.80
(0.031)
相关PDF资料
PDF描述
CPC7592BATR
CPC7592MATR
CPC7592BC
CPC7592MCTR
CPC7592BB
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