参数资料
| 型号： | CS5253B-8GDPR5G |
| 厂商： | ON Semiconductor |
| 文件页数： | 7/9页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.5V 3A D2PAK-5 |
| 产品变化通告： | Product Obsolescence 30/Sept/2009 |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.5V |
| 输入电压： | 最高 13V |
| 电压 - 压降（标准）： | 1.05V @ 3A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 3A |
| 电流 - 限制（最小）： | 3.1A |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-263-6，D²Pak（5 引线+接片），TO-263BA |
| 供应商设备封装： | D2PAK-5 |
| 包装： | 剪切带 (CT) |
| 其它名称： | CS5253B-8GDPR5GOSCT |
CS5253B ? 8
+5.0 V
+3.3 V
V CONTROL
V POWER
V OUT
V SENSE
R DIS
+Load
+
10 m F
+
100 m F
CS5253B ? 8
GND
+
33 m F
Remote
Connections
+
Optional
Local
Connections
GND
Figure 16. Remote Sense
R DIS
? Load
Calculating Power Dissipation and Heatsink
Requirements
High power regulators such as the CS5253B ? 8 usually
operate at high junction temperatures. Therefore, it is
important to calculate the power dissipation and junction
temperatures accurately to ensure that an adequate heatsink
is used. Since the package tab is connected to V OUT on the
CS5253B ? 8, electrical isolation may be required for some
applications. Also, as with all high power packages, thermal
compound in necessary to ensure proper heat flow. For
added safety, this high current LDO includes an internal
thermal shutdown circuit
The thermal characteristics of an IC depend on the
following four factors: junction temperature, ambient
temperature, die power dissipation, and the thermal
resistance from the die junction to ambient air. The
maximum junction temperature can be determined by:
TJ(max) + TA(max) ) PD(max) R q JA
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type. The
maximum power dissipation for a regulator is:
PD(max) + (VIN(max) * VOUT(min))IOUT(max)
) VIN(max) IIN(max)
A heatsink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air. Each material in the heat flow path
between the IC and the outside environment has a thermal
resistance which is measured in degrees per watt. Like series
electrical resistances, these thermal resistances are summed
to determine the total thermal resistance between the die
junction and the surrounding air, R q JA . This total thermal
resistance is comprised of three components. These resistive
terms are measured from junction ? to ? case (R q JC ),
case ? to ? heatsink (R q CS ), and heatsink ? to ? ambient air
(R q SA ). The equation is:
R q JA + R q JC ) R q CS ) R q SA
The value for R q JC is 2.5 ° C/watt for the CS5253B ? 8 in the
D 2 PAK ? 5 package. For a high current regulator such as the
CS5253B ? 8 the majority of heat is generated in the power
transistor section. The value for R q SA depends on the
heatsink type, while the R q CS depends on factors such as
package type, heatsink interface (is an insulator and thermal
grease used?), and the contact area between the heatsink and
the package. Once these calculations are complete, the
maximum permissible value of R q JA can be calculated and
the proper heatsink selected. For further discussion on
heatsink selection, see our application note “Thermal
Management,” document number AND8036/D.
http://onsemi.com
7
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CS5257A-1 | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:7.0 A LDO 5−Pin Adjustable Linear Regulator |
| CS5257A-1/D | 制造商:未知厂家 制造商全称:未知厂家 功能描述:7A LDO 5-Pin Adjustable Linear Regulator |
| CS5257A1GDP5 | 制造商:ON SEMI 功能描述:New |
| CS5257A-1GDP5 | 功能描述:IC REG LDO ADJ 7A D2PAK-5 RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式和可调式 输出电压:3.3V，1.25 V ~ 5.7 V 输入电压:4.5 V ~ 7 V 电压 - 压降（标准）:1.1V @ 1A 稳压器数量:2 电流 - 输出:1A 电流 - 限制（最小）:1A 工作温度:0°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-252-5，DPak（4 引线 + 接片），TO-252AD 供应商设备封装:PPAK 包装:管件 其它名称:497-3576-5 |
| CS5257A-1GDPR5 | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:7.0 A LDO 5−Pin Adjustable Linear Regulator |
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