参数资料
型号: CS8182YDPSR5
厂商: ON Semiconductor
文件页数: 11/12页
文件大小: 0K
描述: IC REG LDO ADJ .2A D2PAK-5
产品变化通告: Product Discontinuation 20/Aug/2008
标准包装: 750
稳压器拓扑结构: 正,可调式
输出电压: 2.8 V ~ 45 V
输入电压: 3.4 V ~ 45 V
电压 - 压降(标准): 0.35V @ 200mA
稳压器数量: 1
电流 - 输出: 200mA
电流 - 限制(最小): 225mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: TO-263-6,D²Pak(5 引线+接片),TO-263BA
供应商设备封装: D2PAK-5
包装: 带卷 (TR)
其它名称: CS8182YDPSR5OS
CS8182
PACKAGE DIMENSIONS
D 2 PAK ? 5
DP SUFFIX
CASE 936AC
ISSUE A
A
B
L1
D
E
E/2
A
H
A
SEATING
PLANE
c2
DETAIL C
E1
0.10
M
D1
B A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH AND GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.005 MAXIMUM PER SIDE. THESE DIMENSIONS
TO BE MEASURED AT DATUM H.
4. THERMAL PAD CONTOUR OPTIONAL WITHIN
DIMENSIONS E, L1, D1, AND E1. DIMENSIONS
D1 AND E1 ESTABLISH A MINIMUM MOUNTING
SURFACE FOR THE THERMAL PAD.
INCHES
MILLIMETERS
e
B
L3
5X
b
0.13
M
c
B A M
RECOMMENDED
SOLDERING FOOTPRINT*
0.424
A
H
VIEW A ? A
SEATING
PLANE
A1
GAUGE
PLANE
L
DIM
A
A1
b
c
c2
D
D1
E
E1
e
H
L
L1
L3
M
MIN MAX
0.170 0.180
0.000 0.010
0.026 0.036
0.017 0.026
0.045 0.055
0.325 0.368
0.250 ???
0.380 0.420
0.200 ???
0.067 BSC
0.580 0.620
0.090 0.110
??? 0.066
0.010 BSC
0 _ 8 _
MIN MAX
4.32 4.57
0.00 0.25
0.66 0.91
0.43 0.66
1.14 1.40
8.25 9.53
6.35 ???
9.65 10.67
5.08 ???
1.70 BSC
14.73 15.75
2.29 2.79
??? 1.68
0.25 BSC
0 _ 8 _
0.310
M
DETAIL C
0.584
0.176
5X
0.040
0.067
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
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