参数资料
| 型号： | CT0402S14AHSG |
| 厂商： | EPCOS Inc |
| 文件页数： | 19/30页 |
| 文件大小： | 0K |
| 描述： | VARISTOR 14VRMS 0402 SMD |
| 产品培训模块： | Ceramic TVS |
| 产品目录绘图： | CT Series_0402 Side CT Series_0402 Top |
| 标准包装： | 1 |
| 系列： | CT 标准 |
| 变阻器电压： | 33V |
| 电流 - 浪涌： | 2A |
| 电路数： | 1 |
| 最大交流电压： | 14VAC |
| 最大直流电压： | 16VDC |
| 能量： | 30J |
| 封装/外壳： | 0402（1005 公制） |
| 其它名称： | 495-3426-6 |
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Multilayer varistors (MLVs)
High-speed series
3.5
Tinned copper alloy
All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering.
3.6
Tinned iron wire
All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb soldering.
4
4.1
Solder joint profiles / solder quantity
Nickel barrier termination
If the meniscus height is too low, that means the solder quantity is too low, the solder joint may
break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-
ed as leaching of the external terminations.
If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur.
As the solder cools down, the solder contracts in the direction of the component. If there is too
much solder on the component, it has no leeway to evade the stress and may break, as in a vise.
The figures below show good and poor solder joints for dual-wave and infrared soldering.
4.1.1
Solder joint profiles for nickel barrier termination - dual-wave soldering
Good and poor solder joints caused by amount of solder in dual-wave soldering.
4.1.2
Solder joint profiles for nickel barrier termination / silver-palladium / silver-platinum
termination - reflow soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 19 of 30
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