参数资料
型号: CU3225K275G2K1
厂商: EPCOS Inc
文件页数: 20/35页
文件大小: 0K
描述: VARISTOR 275V RMS 3225 SMD
产品目录绘图: CU3225K Series_Max V Allowance 230~300 Side1
CU3225K Series_Max V Allowance 230~300 Side2
标准包装: 1
系列: CU
变阻器电压: 430V
电流 - 浪涌: 400A
电路数: 1
最大交流电压: 275VAC
最大直流电压: 350VDC
能量: 8.6J
封装/外壳: 3225(8063 公制)
产品目录页面: 2357 (CN2011-ZH PDF)
其它名称: 495-1464-6
SMD disk varistors (CU varistors)
Standard series
Soldering directions
1
1.1
Terminations
Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base met-
allization layer. This allows great flexibility in the selection of soldering parameters. The tin pre-
vents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel bar-
rier termination is suitable for all commonly-used soldering methods.
Multilayer CTVS: Structure of nickel barrier termination
1.2
Silver-palladium termination
Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips in-
tended for conductive adhesion. This metallization improves the resistance of large chips to ther-
mal shock.
In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corro-
sion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid appli-
cations as well. The silver-palladium termination is not approved for lead-free soldering.
Multilayer varistor: Structure of silver-palladium termination
Please read Cautions and warnings and
Important notes at the end of this document.
Page 20 of 35
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