参数资料
| 型号： | CU3225K35G2 |
| 厂商： | EPCOS Inc |
| 文件页数： | 26/35页 |
| 文件大小： | 0K |
| 描述： | VARISTOR STD 35VRMS 3225 SMD |
| 产品目录绘图： | CU3225K Series_Max V Allowance 11~175 Side1 CU3225K Series_Max V Allowance 11~175 Side2 |
| 标准包装： | 2,000 |
| 系列： | CU |
| 变阻器电压： | 56V |
| 电流 - 浪涌： | 100A |
| 电路数： | 1 |
| 最大交流电压： | 35VAC |
| 最大直流电压： | 45VDC |
| 能量： | 1.1J |
| 封装/外壳： | 3225（8063 公制） |
| 其它名称： | B72650M 350K 72 B72650M0350K072 B72650M350K72 |
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SMD disk varistors (CU varistors)
Standard series
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 ° C and 180 ° C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Solderability tests
Test
Standard
Test conditions
Test conditions
Criteria/ test results
Sn-Pb soldering
Pb-free soldering
Wettability
IEC
Immersion in
Immersion in
Covering of 95% of
60068-2-58 60/40 SnPb solder
using non-activated
flux at 215 ± 3 ° C
for 3 ± 0.3 s
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 ± 5 ° C
for 3 ± 0.3 s
end termination,
checked by visual
inspection
Leaching
IEC
Immersion in
Immersion in
No leaching of
resistance
Thermal shock
(solder shock)
60068-2-58 60/40 SnPb
solder using
mildly activated flux
without preheating
at 260 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
contacts
No deterioration of
electrical parameters.
Capacitance change:
≤ ± 15%
Tests of resistance IEC
Immersion in
Immersion in
Change of varistor
to soldering heat
60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5
voltage:
for SMDs
Tests of resistance IEC
at 260 ° C
Immersion
for 10 s at 260 ° C
Immersion
≤ ± 5%
Change of varistor
to soldering heat
for radial leaded
components
(SHCV)
60068-2-20
of leads in
60/40 SnPb
for 10 s at 260 ° C
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 ° C
voltage: ≤ ± 5%
Change of
capacitance X7R:
≤
5/+10%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 26 of 35
相关PDF资料 |
PDF描述 |
|---|---|
| CU3225K30G2 | VARISTOR STD 30VRMS 3225 SMD |
| CU3225K25G2 | VARISTOR STD 25VRMS 3225 SMD |
| CU3225K230G2 | VARISTOR STD 230VRMS 3225 SMD |
| CU3225K20G2 | VARISTOR STD 20VRMS 3225 SMD |
| CU3225K140G2 | VARISTOR STD 140VRMS 3225 SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CU3225K40G2 | 功能描述:VARISTOR STD 40VRMS 3225 SMD RoHS:是 类别:过电压，电流，温度装置 >> TVS - 变阻器，MOV 系列:CU 标准包装:400 系列:LU 变阻器电压:540V 电流 - 浪涌:6.5kA 电路数:1 最大交流电压:320VAC 最大直流电压:420VDC 能量:150J 封装/外壳:圆盘 20mm |
| CU3225K50G2 | 功能描述:VARISTOR STD 50VRMS 3225 SMD RoHS:是 类别:过电压，电流，温度装置 >> TVS - 变阻器，MOV 系列:CU 标准包装:400 系列:LU 变阻器电压:540V 电流 - 浪涌:6.5kA 电路数:1 最大交流电压:320VAC 最大直流电压:420VDC 能量:150J 封装/外壳:圆盘 20mm |
| CU3225K60G2 | 功能描述:VARISTOR STD 60VRMS 3225 SMD RoHS:是 类别:过电压，电流，温度装置 >> TVS - 变阻器，MOV 系列:CU 产品目录绘图:MOV-14DxxxK_20mm Height Series Front MOV-(07,10,14,20)D_4.8mm Thickness Series Side 标准包装:1,000 系列:- 变阻器电压:360V 电流 - 浪涌:4.5kA 电路数:1 最大交流电压:230VAC 最大直流电压:300VDC 能量:93J 封装/外壳:圆盘 14mm |
| CU3225K75G2 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Monolithic; Standard Series |
| CU3225K95G2 | 功能描述:VARISTOR STD 95VRMS 3225 SMD RoHS:是 类别:过电压，电流，温度装置 >> TVS - 变阻器，MOV 系列:CU 标准包装:400 系列:LU 变阻器电压:540V 电流 - 浪涌:6.5kA 电路数:1 最大交流电压:320VAC 最大直流电压:420VDC 能量:150J 封装/外壳:圆盘 20mm |
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