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参数资料
| 型号： | CXP82852Q |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP100 |
| 封装： | 14 X 20 MM, PLASTIC, QFP-100 |
| 文件页数： | 15/22页 |
| 文件大小： | 320K |
| 代理商： | CXP82852Q |
– 22 –
CXP82832/82840/82852/82860
Package Outline
Unit: mm
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
PACKAGE STRUCTURE
23.9
± 0.4
QFP-100P-L01
100PIN QFP (PLASTIC)
20.0 – 0.1
+ 0.4
0.15 – 0.05
+ 0.1
15.8
±
0.4
17.9
±
0.4
14.0
–
0.1
+
0.4
2.75 – 0.15
+ 0.35
A
0.65
M
0.13
QFP100-P-1420
1.7g
1
100
81
80
51
50
31
30
0.3 – 0.1
+ 0.15
DETAIL A
0 to 10
0.8
±
0.2
(16.3)
0.15
0.1 – 0.05
+ 0.2
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
PACKAGE STRUCTURE
23.9
± 0.4
QFP-100P-L01
100PIN QFP (PLASTIC)
20.0 – 0.1
+ 0.4
0.15 – 0.05
+ 0.1
15.8
±
0.4
17.9
±
0.4
14.0
–
0.1
+
0.4
2.75 – 0.15
+ 0.35
A
0.65
M
0.13
QFP100-P-1420
1.7g
1
100
81
80
51
50
31
30
0.3 – 0.1
+ 0.15
DETAIL A
0 to 10
0.8
±
0.2
(16.3)
0.15
0.1 – 0.05
+ 0.2
Sony Corporation
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
42 ALLOY
SOLDER COMPOSITION
Sn-Bi Bi:1-4wt%
PLATING THICKNESS
5-18
μm
SPEC.
相关PDF资料 |
PDF描述 |
|---|---|
| CXP84200-U01S | 8-BIT, 10 MHz, MICROCONTROLLER, CDIP64 |
| CXXXEZ1000-SXX000 | Cree㈢ EZ1000⑩ LEDs |
| CXXXEZ290-SXX00 | Cree㈢ EZBright290⑩ LEDs |
| CXXXEZ400-SXX000 | Cree㈢ EZ400⑩ LED |
| CXXXEZ700-SXX000 | Cree㈢ EZ700⑩ LED |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CXP82860 | 制造商:SONY 制造商全称:Sony Corporation 功能描述:CMOS 8-bit Single Chip Microcomputer |
| CXP82860Q | 制造商:SONY 制造商全称:Sony Corporation 功能描述:8-Bit Microcontroller |
| CXP828P60 | 制造商:SONY 制造商全称:Sony Corporation 功能描述:CMOS 8-bit Single Chip Microcomputer |
| CXP828P60Q-1 | 制造商:SONY 制造商全称:Sony Corporation 功能描述:8-Bit Microcontroller |
| CXP82900 | 制造商:SONY 制造商全称:Sony Corporation 功能描述:CMOS 8-bit Single Chip Microcomputer |
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