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参数资料
| 型号： | CY74FCT163CTSOCTG4 |
| 厂商： | Texas Instruments |
| 文件页数： | 12/12页 |
| 文件大小： | 0K |
| 描述： | IC SYNC 4-BIT BIN CNTR 16-SOIC |
| 标准包装： | 2,000 |
| 系列： | 74FCT |
| 逻辑类型： | 二进制计数器 |
| 方向： | 上 |
| 元件数： | 1 |
| 每个元件的位元数： | 4 |
| 复位： | 同步 |
| 触发器类型： | 正边沿 |
| 电源电压： | 4.75 V ~ 5.25 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 带卷 (TR) |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
CY54FCT163TLMB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
CY74FCT163CTQCT
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT163CTQCTE4
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT163CTQCTG4
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT163CTSOC
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT163CTSOCE4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT163CTSOCG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT163CTSOCT
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT163CTSOCTE4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT163CTSOCTG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2007
Addendum-Page 1
相关PDF资料 |
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| CY74FCT163CTSOCG4 | IC SYNC 4-BIT BIN CNTR 16-SOIC |
| CY74FCT163CTSOCE4 | IC SYNC 4-BIT BIN CNTR 16-SOIC |
| IDT74FCT162511ATPAG | IC REGISTERD TRCVR 16BIT 56TSSOP |
| IDT74FCT162511CTPVG | IC REGISTERD TRCVR 16BIT 56SSOP |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CY74FCT163H244 | 制造商:TI 制造商全称:Texas Instruments 功能描述:16-Bit Buffers/Line Drivers |
| CY74FCT163H244CPVC | 制造商:TI 制造商全称:Texas Instruments 功能描述:16-Bit Buffers/Line Drivers |
| CY74FCT163H244SSOP | 制造商:TI 制造商全称:Texas Instruments 功能描述:16-Bit Buffers/Line Drivers |
| CY74FCT163H244TSSOP | 制造商:TI 制造商全称:Texas Instruments 功能描述:16-Bit Buffers/Line Drivers |
| CY74FCT163H245 | 制造商:TI 制造商全称:Texas Instruments 功能描述:16-Bit Transceivers |
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