参数资料
型号: CY74FCT827ATSOCE4
厂商: Texas Instruments
文件页数: 4/11页
文件大小: 0K
描述: IC BUFFER TRI-ST 10BIT 24SOICW
标准包装: 25
系列: 74FCT
逻辑类型: 缓冲器/线路驱动器,非反相
元件数: 1
每个元件的位元数: 10
输出电流高,低: 32mA,64mA
电源电压: 4.75 V ~ 5.25 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-SOIC(0.295",7.50mm 宽)
供应商设备封装: 24-SOIC
包装: 管件
CY54FCT827T, CY74FCT827T
10-BIT BUFFERS
WITH 3-STATE OUTPUTS
SCCS034A – SEPTEMBER 1994 – REVISED OCTOBER 2001
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
ORDERING INFORMATION
TA
PACKAGE
SPEED
(ns)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QSOP – Q
Tape and reel
4.4
CY74FCT827CTQCT
FCT827C
SOIC
SO
Tube
4.4
CY74FCT827CTSOC
FCT827C
40
°Cto85°C
SOIC – SO
Tape and reel
4.4
CY74FCT827CTSOCT
FCT827C
–40
°C to 85°C
QSOP – Q
Tape and reel
8
CY74FCT827ATQCT
FCT827A
SOIC
SO
Tube
8
CY74FCT827ATSOC
FCT827A
SOIC – SO
Tape and reel
8
CY74FCT827ATSOCT
FCT827A
–55
°C to 125°C
LCC – L
Tube
9
CY54FCT827ATLMB
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OUTPUT
FUNCTION
OE1
OE2
D
Y
FUNCTION
L
Transparent
L
LH
H
Transparent
H
X
Z
3 state
X
H
X
Z
3-state
H = High logic level, L = Low logic level, X = Don’t care,
Z = High-impedance state
logic diagram (positive logic)
Y0
To Nine Other Channels
OE1
OE2
D0
1
13
223
Pin numbers shown are for the Q and SO packages.
absolute maximum rating over operating free-air temperature range (unless otherwise noted)
Supply voltage range to ground potential
–0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC input voltage range
–0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC output voltage range
–0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC output current (maximum sink current/pin)
120 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 1): Q package
61
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SO package
46
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ambient temperature range with power applied, TA
–65
°C to 135°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
–65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
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