参数资料
型号: D2587P18
英文描述: TOUCHSCREEN 12.1 USB
中文描述: 波长选择高功率D2587P型(与波长锁定)/ D2547P型隔离DFB激光器模块
文件页数: 9/14页
文件大小: 122K
代理商: D2587P18
Wavelength-Selected, High-Power D2587P-Type (with Wavelength
Data Sheet, Rev. 2
Locker)/D2547P-Type Isolated DFB Laser Modules
July 2001
4
Agere Systems Inc.
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
* Does not apply to shipping container.
Parameter
Symbol
Min
Max
Unit
Laser Reverse Voltage
VRLMAX
—2
V
dc Forward Current
IFLMAX
225
mA
Operating Case Temperature Range
TC
–25
70
°C
Storage Case Temperature Range*
Tstg
–40
70
°C
Photodiode Reverse Voltage
VRPDMAX
—10
V
Photodiode Forward Current
IFPDMAX
—2
mA
Handling Precautions
Power Sequencing
To avoid the possibility of damage to the laser module
from power supply switching transients, follow this
turn-on sequence:
1. All ground connections
2. Most negative supply
3. Most positive supply
4. All remaining connections
Reverse the order for the proper turn-off sequence.
Electrostatic Discharge
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge. Take
proper precautions during both han-
dling and testing. Follow guidelines
such as JEDEC Publication No. 108-A
(Dec. 1988).
Agere Systems employs a human-body model (HBM)
for ESD-susceptibility testing and protection-design
evaluation. ESD voltage thresholds are dependent on
the critical parameters used to define the model. A
standard HBM (resistance = 1.5 k
, capacitance = 100
pF) is widely used and, therefore, can be used for com-
parison purposes. The HBM ESD threshold presented
here was obtained using these circuit parameters:
Mounting Instructions
The minimum fiber bend radius is 1.0 in. (25.4 mm)
To avoid degradation in performance, mount the mod-
ule on the board as follows:
1. Place the bottom flange of the module on a flat heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in
size. The surface finish of the heat sink should be
better than 32
in. (0.8 m), and the surface flatness
must be better than 0.001 in. (25.4
m). Using ther-
mal conductive grease is optional; however, thermal
performance can be improved by up to 5% if conduc-
tive grease is applied between the bottom flange and
the heat sink.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw hole locations (see Out-
line Diagram). The Fillister head diameter must not
exceed 0.140 in. (3.55 mm). Do not apply more than
1 in.-lb. of torque to the screws.
Note: Dimensions are in inches and (millimeters).
Figure 4. Fillister Head Screw
Parameter
Value
Unit
Human-body Model
>400
V
0.118
(3.00)
0.062 (1.58)
0.140
(3.56)
0.031 (0.79)
0.129 (3.28) R
0.086
(2.18)
0.041 (1.04)
1-532(C)
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