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| 型号： | D38999/20FJ29SBLC |
| 厂商： | Amphenol Industrial Operations |
| 文件页数： | 40/54页 |
| 文件大小： | 0K |
| 描述： | CONN HSG RCPT 29POS WALL MT SCKT |
| 标准包装： | 1 |
| 系列： | 军用, MIL-DTL-38999 系列 III, Tri-Start™ |
| 连接器类型： | 母触点插座 |
| 位置数： | 29 |
| 外壳尺寸 - 插件： | 25-29 |
| 外壳尺寸，MIL： | J |
| 触点类型：： | 压接 |
| 触点尺寸： | 16 |
| 安装类型： | 面板安装，法兰 |
| 紧固型： | 有螺纹 |
| 方向： | B |
| 外壳材料，表面处理： | 铝，非电镀法镀镍 |
| 防护等级： | 抗环境影响 |
| 特点： | 屏蔽 |
| 包装： | 散装 |
| 请注意： | 不提供触点 |
| 其它名称： | D38999/20FJ29SBLC-ND |
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Tri-Start – accessories
universal “header assembly” for flex print or
PC board mounting
Mounts to all MIL-DTL-38999 and
MIL-C-26482 Connectors
The use of connectors with printed circuit ter-
mination is rapidly gaining popularity due to
the rise of high volume, vapor phase or wave
solder manufacturing processes. Termination
of this style of connector to flex print or a
printed circuit board represents a major cost
in the manufacturing process for users. When
adding flex or printed circuit board assem-
blies to an expensive filter or filter/transient
protection connector, the total cost of a failed
solder joint, a bent pin, or an unanticipated electrical failure becomes prohibitive.
The universal header assembly from Amphenol will provide for easy separation
of the connector from the board on these occasions.
Headers provide easy
separation of the
connector from the PC
board.
Header Assemblies Provide Cost Savings
Incorporation of the header assembly provides the user with time and cost saving
potentials. These header assemblies can be vapor phase or wave soldered to
flex or printed circuit boards prior to the receipt of the EMI/EMP connector.
Headers can be installed to standard connectors, allowing for electrical testing
that would adversely affect the sensitive diodes, MOV’s or capacitors in the
EMI/EMP connectors. Expensive connector assemblies can be easily removed
from and reattached to the header assembly as the manufacturing process
dictates.
Mounting Applications
Shell modifications are recommended, but are not necessary. The header as-
sembly can be attached to connectors with standard flange placement or di-
rectly to the circuit board. The ideal application would involve either a single
flange moved all the way to the rear of the connector or a double flange. Cinch
nuts can be installed in either flange to allow easier mounting to the panel or the
header assembly. The forward flange would mount the connector to the panel;
the rear flange would be used to mount the header assembly. Various types of
captivated or loose attaching screws can be utilized for unique applications.
Amphenol universal headers are slotted to allow mounting to all series of MIL-
DTL-38999 or MIL-C-26482 connectors without special alterations. They are of
similar dimension as the flange of the mounting connector and would be ap-
proximately .185 inches (4.70 mm) thick.
Incorporates a Shorter Pin/Socket Contact
The heart of the header assembly is a short pin/socket contact. The tail of the
contact would accommodate standard through-hole diameters and thickness of
the flex or printed circuit board materials. The socket is imbedded in the molded
material, making electrical engagement with the printed circuit tail of the con-
nector.
Cylindrical Configuration
? 3 PCB stickout dimensions are available.
? Size 22 contacts use .175 thick headers
? Size 16 to 20 contacts use .195 thick
headers
? Consult Amphenol, Sidney NY for additional
configurations.
? Headers for cylindrical connectors accom-
modate up to 128 pins. Consult Amphenol
catalogs for mating connector contact
layouts (12-092 and 12-090 for MIL-DTL-
38999 and 12-070 for MIL-C-26482)
Mounting to Rectangular ARINC Con-
nectors
? Headers for ARINC connector arrangements
accommodate up to 150 pins
? Consult Amphenol, Sidney, NY for ARINC
configurations and detailed dimensions.
Materials
? Body is molded from Torlon or PPS
(Polyphenylene Sulfide)
? Electrical engagement areas of the header
contact are plated with .00003 inches
minimum of gold over .00005 inches
minimum of nickel.
See drawing of standard header on next page.
38
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