参数资料
型号: D3SH-A1L1
厂商: Omron Electronics Inc-EMC Div
文件页数: 6/8页
文件大小: 0K
描述: SWITCH SPST-NO LFT W/BOSS
产品培训模块: Medical Solutions
产品目录绘图: D3SH Left Actuation
D3SH
D3SH Side View
标准包装: 1
系列: D3SH
电路: SPST-NO
开关功能: 关-瞬时
触点额定电压: 0.001A @ 5VDC
触动器类型: 角拨动开关(检测器)
安装类型: 表面贴装
端接类型: SMD(SMT)接片
操作力: 24gf
产品目录页面: 2455 (CN2011-ZH PDF)
其它名称: SW1087DKR
Precautions
Be sure to read the precautions and information common to all Snap Action and Detection Switches, contained in the Technical User’s Guide,
“Snap Action Switches, Technical Information” for correct use.
■ Correct Use
Mounting
The cover has the same electrical potential as the COM terminal. Do not
short-circuit the cover with a NO or NC terminal when mounting the
cover.
cover
Be careful of the following points. Incorrect handling may lead to
insufficient actuator return, Switch damage, or reduced durability.
? Set the operating body in line with the direction of the actuator
movement, and make sure that the operating body is completely
separate from the actuator when the Switch is in the free posi-
tion (FP). When the actuator is operated from the crosswise
direction of the Switch, make sure that the corner of the operat-
ing body has a minimum radius of R1.
■ Caution
Electrical Ratings
Confirm the contact load in order to select an appropriate switch rat-
ing.
Do not apply an excessive electrical load to the contacts, otherwise
the contacts may weld, resulting in a short circuit or burning.
Terminal Connection
Do not use flow soldering or hand soldering to solder terminals.
Conduct reflow soldering within the range shown in the terminal tem-
perature profile below. Some reflow soldering devices have
extremely high peak values. Do a test in advance to confirm proper
soldering conditions.
Do not conduct reflow soldering more than twice. Also provide a time
interval of at least five minutes between the first and second reflow
soldering processes to allow the Switch to return to room tempera-
ture. Heating the Switch continuously (without an interval) may cause
the edges of the Switch to melt and degrade the characteristics.
When printing for a screen solder process, a 0.13-mm screen thick-
ness is recommended.
Be sure to provide local ventilation.
R1 min
Operating b ody
? Set the Switch stroke to 70% to 100% of the overtravel (the differ-
ence between the operating position and the total travel position).
255
MAX
220
150
? Do not subject the Switch to operations that involve strong impact.
Preheating time:
60 to 120 s
Heating time:
40 s max.
? Do not use the Switch as a stopper.
? Do not apply excessive loads to the cover or operate the
actuator from a direction other than a specified operating
direction.
? Do not use an adhesive to secure the Switch.
A lubricant is used in the Switch. Some of the lubricant may seep out
because the Switch does not have an airtight construction. Consider
this possibility with respect to the usage conditions when designing
or using the Switch.
Application Environment
Do not use the Switch in locations that are subject to toxic gas, sili-
con, excessive dust, excessive dirt, high temperatures, high humidity,
sudden temperature changes, water splashes, or oil splashes.
Otherwise, damage resulting by faulty contact of the Switch contacts,
corrosion, or other causes, or other functional faults may occur.
Printed Circuit Boards
Special attention must be paid to the handling of printed circuit
boards after a Switch has been mounted onto them. Airborne PCB
particles may penetrate the interior of the Switch when printed circuit
boards are separated by cutting. Also, do not stack printed circuit
boards that have Switches mounted on them.
Product Specification Details
This document provides only a partial list of specifications. It is rec-
ommended that you request complete drawings and specifications
prior to purchasing or using the product.
■ RoHS Directive Compliance
Models that are indicated as being RoHS compliant are free of the
following six substances.
Insulation and Wiring
Be sure that the installation conditions provide a sufficient insulation
distance between Switch terminals and other metal parts, lands, etc.
Cleaning
The Switch does not have an airtight construction, and it must not be
cleaned with cleaning fluids. Malfunctions may occur if the cleaning
fluid penetrates the interior of the Switch together with flux or foreign
matter from the surface of the PCB.
Confirmation with Actual Equipment
Be sure to confirm the quality of the product under the load and
environmental conditions that will be used during actual applications.
Lead:
Mercury:
Cadmium:
Hexavalent chromium:
PBB:
PBDE:
1,000 ppm max.
1,000 ppm max.
100 ppm max.
1,000 ppm max.
1,000 ppm max.
1,000 ppm max.
68
Surface Mount Detection Switch
D3SH
相关PDF资料
PDF描述
ASFLMB-20.000MHZ-LC-T OSC MEMS 20.000 MHZ SMD
D3SH-A0L SWITCH SPST-NO LFT NO BOSS
ASFLMB-40.000MHZ-LC-T OSC MEMS 40.000 MHZ SMD
ASFLMB-33.000MHZ-LC-T OSC MEMS 33.000 MHZ SMD
ASFLMB-14.7456MHZ-LC-T OSC MEMS 14.7456 MHZ SMD
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