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参数资料
| 型号： | D6NF1G960P1BR-Z |
| 厂商： | Taiyo Yuden |
| 文件页数： | 11/11页 |
| 文件大小： | 0K |
| 描述： | DUPLEXER SAW 1.96GHZ W-CDMA II |
| 标准包装： | 1 |
| 系列： | D6 |
| 频率： | 1.96GHz 中心 |
| 带宽： | 59MHz |
| 滤波器类型： | 带通 |
| 插入损耗： | 3.4dB |
| 应用： | 手机，WCDMA |
| 封装/外壳： | 9-SMD，无引线 |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 高度（最大）： | 0.026"（0.65mm） |
| 尺寸/尺寸： | 0.098" L x 0.079" W（2.50mm x 2.00mm） |
| 其它名称： | 587-3002-6 |
10. High Temperature Bias
Specified Value
Test Methods and
Remarks
11. Solderbility 1
Specified Value
Test Methods and
Remarks
12. Solderbility 2
Specified Value
Test Methods and
Remarks
After testing, meet the specified characteristics at a room temperature.
＋50℃, ＋29dBm, 50000hours.
More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Lead-free Solder paste, Reflow；Peak temperature 245℃
More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Sn-Pb Solder paste, Reflow；Peak temperature 235℃
13. Solder heat resistance
Specified Value
After testing, meet the specified characteristics at a room temperature.
A change of the remarkable appearance do not have it.
◆Recommended temperature profile of reflow soldering
Figure shows recommended temperature profile of reflow soldering in the case of lead-free solder alloy Sn3.0Ag0.5Cu.
Suitable condition for solder heating is differed depending on composition and manufacturing method.
Please contact to solder manufacturer for the details.
Test Methods and
Remarks
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
sawfilter_reli_e-E02R01
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