参数资料
| 型号： | DA-T268-101E |
| 厂商： | Ohmite |
| 文件页数： | 1/2页 |
| 文件大小： | 0K |
| 描述： | HEATSINK FOR TO-268 BLACK |
| 产品培训模块： | Quick Heatsink Guide |
| 产品目录绘图： | D(A,V)-T263, 268 Series TO-268 Footprint 1 TO-268 Footprint 2 |
| 标准包装： | 10 |
| 系列： | D |
| 类型： | 顶部安装 |
| 冷却式包装： | D³Pak |
| 固定方法： | 可焊底座 |
| 形状： | 矩形 |
| 长度： | 0.500"（12.70mm） |
| 宽： | 1.220"（30.99mm） |
| 机座外的高度（散热片高度）： | 0.400"（10.16mm） |
| 温升时的功耗： | 5W @ 35°C |
| 材质： | 铝 |
| 材料表面处理： | 黑色阳极化处理 |
| 产品目录页面： | 2257 (CN2011-ZH PDF) |
1-866-9-OHMITE Int’l 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info@ohmite.com
2
D Series
Heatsink For TO-252, TO-263
and TO-268 devices
Heat D i SS ip ation
THERMAL
MANAGEMENT
HEATSINK
Fea ture S
Increasedsurfaceareasby3timesthereforether-
malperformanceupto300%overthealuminum
stampedheatsinksonmarkets
Lightweightaluminumconstructionallowsfaster
pickandplaceassemblyreducingthemanufactur-
ingcycletime
Radiusmounted“Rollers”aredesignedformaxi-
mizingheattransferfromthecomponentand
avoidingthethermal“bottle-neck”seeninstamped
andstakedheatsinks.
Availableinbulkpackagingortape&reel(250
unitsperreel
RoHSCompliant
OhmiteDSeriesheatsinksprovideaninnovative
solutionforSMTcompatiblesemiconductorsand
resistors.Theuniquedesign(PatentPending)com-
binestinplated,solderablerodswithanaluminum
extrudedheatsinkbody.Theserods(or“rollers”)
arematedmechanicallytotheheatsinkbyforgingto
reducethethermalresistancebetweentheheatsink
bodyandthesolderablefeet.
Specificallydesignedforusewiththeincreasingly
popularTO-252,TO-263andTO-268packages,the
DSeriesaffordstheusersuperiorthermalperfor-
manceoverthemorecommonstampedaluminum
heatsinks.Byeliminatingthestakingjointtypically
usedinstampedheatsinks,theresultingairgapand
thermal“bottle-neck”isalsoeliminated,whilesur-
faceareaforcoolingismaximizedwiththeextruded
finsoftheDSeriesbody.
Finalthermalperformance
ishighlydependentonthe
thermalcharacteristicsof
thePCB.Itispossibletosee
a50%dropintemprisein
naturalconvectionwitha
thermallyimprovedPCB.
800
400
600
50
Heat Dissipated (watts)
40
30
25
8
4
45
35
26
10
60
14
6
4
8
10
12
200
1000
Air Velocity (ft./min.)
55
Case
Te
mp.
Rise
above
Ambient
(
C)
Thermal
Resistance
from
Mounting
Surface
to
Ambient
(
C/watts)
TO-252 (D)
TO-263 (D2)
101 & 201
301
Case
Te
mp.
Rise
above
Ambient
(
C)
Heat Dissipated (watts)
40
30
25
8
4
45
35
26
10
50
Thermal
Resistance
from
Mounting
Surface
to
Ambient
(
C/watts)
6
2
4
8
10
12
800
400
200
600
1000
Air Velocity (ft./min.)
TO-268 (D3)
101 & 201
301
D imen S ion S
0.56"
(14.2mm)
0.44"
(11.2mm)
0.27"
6.86mm
0.40"
10.16mm
0.10"
2.54mm
0.50"
12.7mm
0.56" (14.2mm)
0.44" (11.2mm)
0.27"
6.86mm
0.40"
10.16mm
0.10"
2.54mm
0.50"
12.7mm
TO-252 (D)
TO-263 (D2)
1.02"
25.91mm
TO-268 (D3)
1.22"
31.0mm
TO-252 (D)
TO-263 (D2)
0.75" (19.1mm)
0.63" (16.1mm)
TO-268 (D3)
1.58"
40.2mm
1.02"
25.91mm
0.50"
12.7mm
0.64"
16.2mm
0.76"
19.2mm
0.15"
3.7mm
0.46"
11.6mm
0.26"
6.6mm
1.02"
25.9mm
0.44"
11.1mm
0.56"
14.1mm
0.50"
12.7mm
0.48"REF
12.1mm
0.09"
2.3mm
0.26"
6.6mm
Style 10
Style 30
Style 20
相关PDF资料 |
PDF描述 |
|---|---|
| FX11LB-140P-SV | CONN HEADER 140POS W/O POSTS SMD |
| 365057-3 | 2P TAB HSG BLK |
| AXN1500115P | CONN HDR/SCKT .8MM 50POS SMD |
| 925369-2 | CONN RCPT HOUSING 2POS CRIMP |
| PS2841-4B-F3-AX | ISOLAT 1.5KVRMS 4CH TRANS 12SSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DA-T268-101E | 制造商:Ohmite Mfg Co 功能描述:Heat Sink |
| DA-T268-101E-TR | 功能描述:散热片 HEATSINK FOR TO-268 BLK ANODIZED RoHS:否 制造商:Ampro By ADLINK 产品:Heat Sink Accessories 安装风格:Through Hole 散热片材料: 散热片样式: 热阻: 长度: 宽度: 高度: 设计目的:Express-HRR |
| DA-T268-301E | 功能描述:散热片 HEATSINK FOR TO-268 RoHS:否 制造商:Ampro By ADLINK 产品:Heat Sink Accessories 安装风格:Through Hole 散热片材料: 散热片样式: 热阻: 长度: 宽度: 高度: 设计目的:Express-HRR |
| DA-T268-301E-TR | 功能描述:散热片 HEATSINK FOR TO-268 RoHS:否 制造商:Ampro By ADLINK 产品:Heat Sink Accessories 安装风格:Through Hole 散热片材料: 散热片样式: 热阻: 长度: 宽度: 高度: 设计目的:Express-HRR |
| DAT-27-619-10 | 制造商:Brady Corporation 功能描述:DOT MATRIX PRINTABLE LABELS, 0.750 IN X 0.250 IN (19.05 MM X 6.35 MM) LABELS |
发布紧急采购，3分钟左右您将得到回复。