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参数资料
| 型号： | DAC1350X |
| 英文描述： | DAC1350X 10BIT 75MSPS Quad-DAC|Data Sheet |
| 中文描述： | DAC1350X 10位75MSPS四援|数据资料 |
| 文件页数： | 5/15页 |
| 文件大小： | 228K |
| 代理商： | DAC1350X |
SEC ASIC
DAC1350X
10BIT 75MSPS Quad DAC
ANALOG
PC BOARD LAYOUT CONSIDERATIONS
PC Board Considerations
To minimize noise on the power lines and the ground lines, the digital inputs
need to be shielded and de-coupled. This trace length between groups
of vdd
(AVDD33A,AVDD33A) pins short as possible so as to minimize inductive ringing.
Supply De-coupling and Planes
For the de-coupling capacitor between the power line and the ground line,
0.1
F ceramic capacitor is used in parallel with a 10F tantalum capacitor.
The digital power plane(AVDD33A) and analog power plane(AVDD33A) are
connected
through a ferrite bead, and also the digital ground plane(AVSS33A)
and the analog ground plane(AVSS33A). This ferrite bead should be located
within 3inches of the dac1350x The analog power plane supplies power to
the dac1350x of the analog output pin and related devices.
Analog Signal Interconnect
To minimized noise pickup and reflections due to impedance mismatch, the dac1350x
should be located as close as possible to the output connector.
The line between DAC output and monitor
input should also be
regarded as
a
transmission line. Due to the fact, it can cause problems
in transmission line
mismatch. As a solution to these problems, the double-termination methods used.
By using this, both ends of the termination lines are matched, providing an ideal,
non-reflective system.
CORE
LAYOUT
GUIDE
(OPTIONAL)
Layout DAC core replacement
It is recommended that you use thick analog power metal. when connecting to PAD, the path should
be kept as short as possible, and use branch metal to connect to the center of analog switch block.
It is recommended that you use thick analog output metal(at least more than 25m) when connecting
to PAD, and also the path length should be kept as short as possible.
Digital power and analog power are separately used.
When it is connected to other blocks, it must be double shielded using N-well and P+ active to
remove the substrate and coupling noise. In that case, the power metal should be connected to PAD directly.
Bulk power is used to reduce the influence of substrate noise.
You must use more than two pins for AVDD33A because it require much current dissipation(about 93mA)
It is recommended that analog metal line(including IRSET,VREFOUT,IOUT0,IOUT1,IOUT2,IOUT3) and analog
power metal
line
should be layout alone and should not mixed with other noisy digital metal lines.
If this core is used as a function block in larger main chip, you can join digital power metal of this core
with the main digital power instead of using new digital power pad for this core. But you must use new
analog power pad for the analog power of this core.
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