参数资料
型号: DAC312HSZ
厂商: Analog Devices Inc
文件页数: 10/14页
文件大小: 0K
描述: IC DAC 12BIT MULTIPLY HS 20-SOIC
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 37
设置时间: 250ns
位数: 12
数据接口: 并联
转换器数目: 1
电压电源: 双 ±
功率耗散(最大): 375mW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商设备封装: 20-SOIC W
包装: 管件
输出数目和类型: 2 电流,单极;2 电流,双极
采样率(每秒): *
产品目录页面: 786 (CN2011-ZH PDF)
DAC312
–5–
REV. C
ORDERING GUIDE
1
Temperature
Package
Model
DNL
Range
Description
Option
DAC312ER
2
± 1/2 LSB 0°C to +70°C
Cerdip-20
Q-20
DAC312FR
± 1 LSB
–40
°C to +85°C
Cerdip-20
Q-20
DAC312BR/883
± 1 LSB
–55
°C to +125°C Cerdip-20
Q-20
DAC312HP
± 1 LSB
–40
°C to +85°C
Plastic DIP-20 N-20
DAC312HS
± 1 LSB
–40
°C to +85°C
SOL-20
R-20
NOTES
1Burn-in is available on commercial and industrial temperature range parts in
cerdip, plastic DIP, and TO-can packages.
2For devices processed in total compliance to MIL-STD-883, add/883 after part
number. Consult factory for 883 data sheet.
ABSOLUTE MAXIMUM RATINGS
1
Operating Temperature
DAC312E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
°C to +70°C
DAC312F, DAC312H . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Storage Temperature (Tj) . . . . . . . . . . . . . . . . . –65
°C to +125°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . . . . 300
°C
Power Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5 V to +18 V
Analog Current Outputs . . . . . . . . . . . . . . . . . . . . –8 V to +12 V
Reference Inputs V14, V15 . . . . . . . . . . . . . . . . . . . . . . . V– to V+
Reference Input Differential Voltage (V14, V15) . . . . . . . . . . ± 18 V
Reference Input Current (I14) . . . . . . . . . . . . . . . . . . . . . 1.25 mA
Package Type
JA
2
JC
Units
20-Pin Hermetic DIP (R)
76
11
°C/W
20-Pin Plastic DIP (P)
69
27
°C/W
20-Pin SOL (S)
88
25
°C/W
NOTES
1Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θ
JA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for cerdip and P-DIP packages;
θ
JA is specified for device soldered to
printed circuit board for SOL package.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC312 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
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