参数资料
型号: DAC7664YT
厂商: TEXAS INSTRUMENTS INC
元件分类: DAC
英文描述: PARALLEL, WORD INPUT LOADING, 12 us SETTLING TIME, 16-BIT DAC, PQFP64
封装: GREEN, PLASTIC, LQFP-64
文件页数: 12/32页
文件大小: 661K
代理商: DAC7664YT
DAC7664
SBAS271 MARCH 2004
www.ti.com
2
ORDERING INFORMATION(1)
PRODUCT
PACKAGELEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
DAC7664Y
LQFP64
PM
40
°C to +85°C
DAC7664Y
DAC7664YT
Tape and Reel, 250
DAC7664Y
LQFP64
PM
40
°C to +85°C
DAC7664Y
DAC7664YR
Tape and Reel, 1500
DAC7664YB
LQFP64
PM
40
°C to +85°C
DAC7664YB
DAC7664YBT
Tape and Reel, 250
DAC7664YB
LQFP64
PM
40
°C to +85°C
DAC7664YB
DAC7664YBR
Tape and Reel, 1500
DAC7664YC
LQFP64
PM
40
°C to +85°C
DAC7664YC
DAC7664YCT
Tape and Reel, 250
DAC7664YC
LQFP64
PM
40
°C to +85°C
DAC7664YC
DAC7664YCR
Tape and Reel, 1500
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
DAC7664
UNIT
IOVDD, VCC and VDD to VSS
0.3 to 11
V
IOVDD, VCC and VDD to GND
0.3 to 5.5
V
Digital Input Voltage to GND
0.3 to VDD + 0.3
V
Digital Output Voltage to GND
0.3 to VDD + 0.3
V
ESD-CDM
200
V
Maximum Junction Temperature
+150
°C
Operating Temperature Range
40 to +85
°C
Storage Temperature Range
65 to +125
°C
Lead Temperature (soldering, 10s)
+300
°C
(1) Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond
those specified is not implied.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
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