参数资料
| 型号： | DAC8248FP |
| 厂商： | Analog Devices Inc |
| 文件页数： | 11/16页 |
| 文件大小： | 0K |
| 描述： | IC DAC 12BIT DUAL BUFFERD 24-DIP |
| 产品培训模块： | Data Converter Fundamentals DAC Architectures |
| 标准包装： | 15 |
| 设置时间： | 1µs |
| 位数： | 12 |
| 数据接口： | 并联 |
| 转换器数目： | 2 |
| 电压电源： | 单电源 |
| 功率耗散（最大）： | 50µW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 24-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 24-PDIP |
| 包装： | 管件 |
| 输出数目和类型： | 2 电流，单极；2 电流，双极 |
| 采样率（每秒）： | 1M |
DAC8248
–4–
REV. B
ORDERING GUIDE
1
Relative
Accuracy
Gain Error
Temperature
Package
Model
(+5 V or +15 V)
Range
Description
DAC8248AW
2
±1/2 LSB
±1 LSB
–55
°C to +125°C
24-Pin Cerdip
DAC8248EW
±1/2 LSB
±1 LSB
–40
°C to +85°C
24-Pin Cerdip
DAC8248GP
±1/2 LSB
±2 LSB
0
°C to +70°C
24-Pin Plastic DIP
DAC8248FW
±1 LSB
±4 LSB
–40
°C to +85°C
24-Pin Cerdip
DAC8248HP
±1 LSB
±4 LSB
0
°C to +70°C
24-Pin Plastic DIP
DAC8248FP
±1 LSB
±4 LSB
–40
°C to +85°C
24-Pin Plastic DIP
DAC8248HS
3
±1 LSB
±4 LSB
0
°C to +70°C
24-Pin SOL
NOTES
1Burn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages.
2For devices processed in total compliance to MIL-STD-883, add/883 after part number. Consult factory for 883 data sheet.
3For availability and burn-in information on SO and PLCC packages, contact your local sales office.
(continued from page 1)
operates on a single supply from +5 V to +15 V, and it dissi-
pates less than 0.5 mW at +5 V (using zero or VDD logic levels).
The device is packaged in a space-saving 0.3", 24-pin DIP.
The DAC8248 is manufactured with PMI’s highly stable thin-
film resistors on an advanced oxide-isolated, silicon-gate,
CMOS technology. PMI’s improved latch-up resistant design
eliminates the need for external protective Schottky diodes.
ABSOLUTE MAXIMUM RATINGS
(TA = +25°C, unless otherwise noted.)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V
AGND to DGND . . . . . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V
Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD +0.3 V
IOUT A, IOUT B to AGND . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V
VREF A, VREF B to AGND . . . . . . . . . . . . . . . . . . . . . . . .
±25 V
VRFB A, VRFB B to AGND . . . . . . . . . . . . . . . . . . . . . . . .
±25 V
Operating Temperature Range
AW Version . . . . . . . . . . . . . . . . . . . . . . . –55
°C to +125°C
EW, FW, FP Versions . . . . . . . . . . . . . . . . –40
°C to +85°C
GP, HP, HS Versions . . . . . . . . . . . . . . . . . . . 0
°C to +70°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°C
Package Type
JA
1
JC
Units
24-Pin Hermetic DIP (W)
69
10
°C/W
24-Pin Plastic DIP (P)
62
32
°C/W
24-Pin SOL (S)
72
24
°C/W
NOTE
1
JA specified for worst case mounting conditions, i.e.,
JA is specified for device in
socket for cerdip and P-DIP packages; JA is specified for device soldered to printed
circuit board for SOL package.
CAUTION
1. Do not apply voltages higher than VDD or less than GND
potential on any terminal except VREF and RFB.
2. The digital control inputs are Zener-protected; however,
permanent damage may occur on unprotected units from
high energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Do not insert this device into powered sockets; remove
power before insertion or removal.
4. Use proper antistatic handling procedures.
5. Devices can suffer permanent damage and/or reliability deg-
radation if stressed above the limits listed under Absolute
Maximum Ratings for extended periods. This is a stress rat-
ing only and functional operation at or above this specifica-
tion is not implied.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8248 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| DAC8248FPZ | 功能描述:IC DAC 12BIT DUAL BUFFERD 24DIP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 设置时间:4µs 位数:12 数据接口:串行 转换器数目:2 电压电源:单电源 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-uMAX 包装:管件 输出数目和类型:2 电压，单极 采样率（每秒）:* 产品目录页面:1398 (CN2011-ZH PDF) |
| DAC8248FPZ | 制造商:Analog Devices 功能描述:12BIT DAC CMOS DUAL 8248 DIP24 |
| DAC8248FS | 功能描述:IC DAC 12BIT DUAL W/BUFF 24-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1,000 系列:- 设置时间:1µs 位数:8 数据接口:串行 转换器数目:8 电压电源:双 ± 功率耗散（最大）:941mW 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC W 包装:带卷 (TR) 输出数目和类型:8 电压，单极 采样率（每秒）:* |
| DAC8248FS-REEL | 功能描述:IC DAC 12BIT DUAL W/BUFF 24-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Data Converter Fundamentals DAC Architectures 标准包装:750 系列:- 设置时间:7µs 位数:16 数据接口:并联 转换器数目:1 电压电源:双 ± 功率耗散（最大）:100mW 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-LCC（J 形引线） 供应商设备封装:28-PLCC（11.51x11.51） 包装:带卷 (TR) 输出数目和类型:1 电压，单极；1 电压，双极 采样率（每秒）:143k |
| DAC8248FSZ | 功能描述:IC DAC 12BIT DUAL W/BUFF 24SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:1 系列:- 设置时间:4.5µs 位数:12 数据接口:串行，SPI? 转换器数目:1 电压电源:单电源 功率耗散（最大）:- 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOICN 包装:剪切带 (CT) 输出数目和类型:1 电压，单极；1 电压，双极 采样率（每秒）:* 其它名称:MCP4921T-E/SNCTMCP4921T-E/SNRCTMCP4921T-E/SNRCT-ND |
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