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参数资料
| 型号： | DC1370A-L |
| 厂商： | Linear Technology |
| 文件页数： | 21/34页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO 25MSPS LTC2256-12 |
| 软件下载： | QuikEval II System |
| 设计资源： | DC1370A Design Files |
| 标准包装： | 1 |
| 系列： | * |
| 相关产品： | DC718C-ND - DEMO QUIKEVAL-II DATA |
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LTC2258-12
LTC2257-12/LTC2256-12
28
225812fd
For more information www.linear.com/LTC2258-12
applicaTions inForMaTion
REGISTER A4: DATA FORMAT REGISTER (ADDRESS 04h)
D7
D6
D5
D4
D3
D2
D1
D0
X
OUTTEST2
OUTTEST1
OUTTEST0
ABP
RAND
TWOSCOMP
Bit 7-6
Unused, Don’t Care Bits.
Bits 5-3
OUTTEST2:OUTTEST0
Digital Output Test Pattern Bits
000 = Digital Output Test Patterns Off
001 = All Digital Outputs = 0
011 = All Digital Outputs = 1
101 = Checkerboard Output Pattern. OF, D11-D0 Alternate Between 1 0101 0101 0101 and 0 1010 1010 1010
111 = Alternating Output Pattern. OF, D11-D0 Alternate Between 0 0000 0000 0000 and 1 1111 1111 1111
Note: Other Bit Combinations are not Used
Bit 2
ABP
Alternate Bit Polarity Mode Control Bit
0 = Alternate Bit Polarity Mode Off
1 = Alternate Bit Polarity Mode On
Bit 1
RAND
Data Output Randomizer Mode Control Bit
0 = Data Output Randomizer Mode Off
1 = Data Output Randomizer Mode On
Bit 0
TWOSCOMP Two’s Complement Mode Control Bit
0 = Offset Binary Data Format
1 = Two’s Complement Data Format
Note: ABP = 1 forces the output format to be Offset Binary
GROUNDING AND BYPASSING
The LTC2258-12/LTC2257-12/LTC2256-12 requires a
printed circuit board with a clean unbroken ground plane.
A multilayer board with an internal ground plane is rec-
ommended. Layout for the printed circuit board should
ensure that digital and analog signal lines are separated as
much as possible. In particular, care should be taken not
to run any digital track alongside an analog signal track
or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass
capacitorsmustbelocatedasclosetothepinsaspossible.
Of particular importance is the 0.1F capacitor between
REFH and REFL. This capacitor should be on the same
side of the circuit board as the A/D, and as close to the
device as possible (1.5mm or less). Size 0402 ceramic
capacitors are recommended. The larger 2.2F capacitor
between REFH and REFL can be somewhat further away.
The VCM capacitor should be located as close to the pin
as possible. To make space for this the capacitor on VREF
can be further away or on the back of the PC board. The
traces connecting the pins and bypass capacitors must
be kept short and should be made as wide as possible.
The analog inputs, encode signals, and digital outputs
should not be routed next to each other. Ground fill and
grounded vias should be used as barriers to isolate these
signals from each other.
HEAT TRANSFER
Most of the heat generated by the ADC is transferred from
the die through the bottom-side exposed pad and package
leadsontotheprintedcircuitboard.Forgoodelectricaland
thermal performance, the exposed pad must be soldered
to a large grounded pad on the PC board.
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