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参数资料
| 型号： | DC1386B |
| 厂商： | Linear Technology |
| 文件页数： | 14/26页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO LTM8032 |
| 产品培训模块： | µModule® Family of EN55022 Class B Certified Regulators |
| 软件下载： | LTM8032 Spice Model |
| 设计资源： | DC1386B Schematic DC1386B Design Files |
| 标准包装： | 1 |
| 系列： | µModule® |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 3.3V |
| 电流 - 输出： | 2A |
| 输入电压： | 5.5 ~ 36 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 600kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM8032EV |
LTM8032
APPLICATIONS INFORMATION
PCB Layout
Most of the headaches associated with PCB layout have
been alleviated or even eliminated by the high level of
integration of the LTM8032. The LTM8032 is neverthe-
less a switching power supply and care must be taken to
minimize EMI and ensure proper operation. Even with the
high level of integration, you may fail to achieve specified
operation with a haphazard or poor layout. See Figure 4
for a suggested layout.
Ensure that the grounding and heat sinking are acceptable.
A few rules to keep in mind are:
1. Place the R ADJ and R T resistors as close as possible to
their respective pins.
2. Place the C IN capacitor as close as possible to the V IN
and GND connection of the LTM8032. If a capacitor
is connected to the FIN terminals, place it as close
GND
as possible to the FIN terminals, such that its ground
connection is as close as possible to that of the C IN
capacitor.
3. Place the C OUT capacitor as close as possible to the
V OUT and GND connection of the LTM8032.
4. Place the C IN and C OUT capacitors such that their
ground currents flow directly adjacent or underneath
the LTM8032.
5. Connect all of the GND connections to as large a copper
pour or plane area as possible on the top layer. Avoid
breaking the ground connection between the external
components and the LTM8032.
6. Use vias to connect the GND copper area to the board’s
internal ground plane. Liberally distribute these GND vias
to provide both a good ground connection and thermal
path to the internal planes of the printed circuit board.
C OUT
AUX
BIAS
FIN
SYNC
RUN/SS
V IN
OPTIONAL
FIN
CAPACITOR
V OUT
C IN
GND
8032 F04
Figure 4. Layout Showing Suggested External Components,
GND Plane and Thermal Vias (LGA Package)
8032fg
14
For more information www.linear.com/LTM8032
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