参数资料
型号: DC1813A-F
厂商: Linear Technology
文件页数: 15/28页
文件大小: 0K
描述: BOARD SAR ADC LTC2368-18
软件下载: QuikEval II System
设计资源: DC1813A Design File
DC1813A Schematic
标准包装: 1
系列: QuikEval-II™
ADC 的数量: 1
位数: 18
采样率(每秒): 1M
数据接口: 串行,SPI?
输入范围: 0 ~ VREF
在以下条件下的电源(标准): 13.5mW @ 1MSPS
工作温度: 0°C ~ 70°C
已用 IC / 零件: LTC2368-18
已供物品:
相关产品: LTC2368IMS-18#TRPBF-ND - IC ADC 18BIT 1M 1CH 16MSOP
LTC2368IMS-18#PBF-ND - IC ADC 18BIT 1M 1CH 16MSOP
LTC2368IDE-18#TRPBF-ND - IC ADC 18BIT 1M 1CH 16DFN
LTC2368HMS-18#TRPBF-ND - IC ADC 18BIT 1M 1CH 16MSOP
LTC2368CMS-18#TRPBF-ND - IC ADC 18BIT 1M 1CH 16MSOP
LTC2368CDE-18#TRPBF-ND - IC ADC 18BIT 1M 1CH 16DFN
LTC2368IDE-18#PBF-ND - IC ADC 18BIT 1M 1CH 16DFN
LTC2368HMS-18#PBF-ND - IC ADC 18BIT 1M 1CH 16MSOP
LTC2368CDE-18#PBF-ND - IC ADC 18BIT SPI/SRL 1M 16DFN
LTC2368CMS-18#PBF-ND - IC ADC 18BIT SPI/SRL 1M 16MSOP
更多...
LT6202/LT6203/LT6204
22
620234fd
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
PACKAGE DESCRIPTION
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.125
TYP
2.38
±0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25
± 0.05
2.38
±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65
±0.05
(2 SIDES)
2.10
±0.05
0.50
BSC
0.70
±0.05
3.5
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
GN16 (SSOP) 0204
1 2 3 4 5 6 7 8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.016 – .050
(0.406 – 1.270)
.015 ±.004
(0.38 ±0.10)
× 45°
0° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165 ±.0015
.045 ±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
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