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参数资料
| 型号： | DEMO1985MC34940E |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 6/12页 |
| 文件大小： | 0K |
| 描述： | KIT DEMO FOR MC34940E FAMILY |
| 标准包装： | 1 |
| 传感器类型： | 触摸，电容式 |
| 接口： | 模拟 |
| 电源电压： | 9 V ~ 18 V |
| 嵌入式： | 否 |
| 已供物品： | 板 |
| 已用 IC / 零件： | MC34940 |
| 相关产品： | MC34940EGR2-ND - IC IMAGING DEVICE ELEC 24-SOICW MC34940EG-ND - IC IMAGING DEVICE ELECT 24-SOICW |
Sensors
Freescale Semiconductor
3
MC34940
Table 1. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Peak VPWR Voltage
VPWRPK
40
V
Double Battery
1 Minute Maximum TA = 30°C
VDBLBAT
26.5
V
ESD Voltage
Human Body Model (CZAP = 100 pF, RZAP = 1500 )
Machine Model (CZAP = 200 pF, RZAP = 0 )
Charge Device Model (CDM), Robotic (CZAP = 4.0 pF)
VESD
±2000
±200
±1200
V
THERMAL RATINGS
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-0 to 90
°C
Operating Junction Temperature
TJ
-0 to 150
°C
Thermal Resistance
Junction-to-Ambient (1)
Junction-to-Case (2)
Junction-to-Board (3)
RθJA
RθJC
RθJB
41
0.2
3.0
°C/W
Soldering Temperature (4)
TSOLDER
260
°C
Notes
1.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with
SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
2.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature.
3.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
4.
Terminal soldering temperature limit is for 10 seconds maximum duration. The device is not designed for immersion soldering.
Exceeding these limits may cause malfunction or permanent damage to the device.
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