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参数资料
| 型号： | DEMO9S08AW60E |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 13/24页 |
| 文件大小： | 0K |
| 描述： | DEMO BOARD FOR MC9S08AW60 |
| 标准包装： | 1 |
| 系列： | HCS08 |
| 类型： | MCU |
| 适用于相关产品： | MC9S08AW60 |
| 所含物品： | 板，线缆，CD |
| 产品目录页面： | 730 (CN2011-ZH PDF) |
| 相关产品： | MC9S08AW60CPUER-ND - IC MCU 60K FLASH 4K RAM 64LQFP MC9S08AW60CFGER-ND - IC MCU 60K FLASH 4K RAM 44-LQFP MC9S08AW60MFUE-ND - IC MCU 8BIT 60K FLASH 64-QFP MC9S08AW60MFGE-ND - IC MCU 8BIT 60K FLASH 44-LQFP MC9S08AW60MFDE-ND - IC MCU 8BIT 60K FLASH 48-QFN MC9S08AW60CPUE-ND - IC MCU 60KB FLASH 64-LQFP MC9S08AW60CFUERTR-ND - IC MCU 60KB FLASH 64-QFP MC9S08AW60CFUE-ND - IC MCU 60KB FLASH 64-QFP MC9S08AW60CFGE-ND - IC MCU 60KB FLASH 44-LQFP MC9S08AW60CFDE-ND - IC MCU 60KB FLASH 48-QFN |
alone BDM interface available (J32). This header is non-populated in the
default configuration and can be installed by the user if needed.
1.8.1 Integrated BDM
The DEMO9S08AW60E features an integrated USB-BDM debugger from
P&E Microcomputer Systems. All necessary signals are provided via the
integrated debugger. A USB type B connector (J33) provides the connection
between the DEMO9S08AW60E and your host PC.
The integrated debugger provides the DEMO9S08AW60E with power
eliminating the need to power the board externally. Power is derived from the
USB bus, therefore total current consumption should not exceed 500mA.
Excessive current drain will violate the USB spec and damage to your Host
PC’s USB hub or the DEMO9S08AW60E could occur.
1.8.2 BDM Header
J32 is the stand alone BDM header. Use of this port requires the user to solder
a 2 x 6 100 mil center header on the board. The pinout is as follows:
Table 1-2 BDM Connector (J32) Pinout
BKGD
NC
NC
1
3
5
2
4
6
GND
RESET_B
VDD
1.8.3 Socketed MCU
The MC9S08AW60 silicon is socketed on the DEMO9S08AW60E board. This
socket is an open top, spring actuated, 0.8mm pitch socket. It is made by Wells
Electronics, part number 7314-064-0-08. Before connecting power to the demo
board the silicon should be installed in this socket. Using your thumb and index
finger, press down on the socket until it is fully actuated. Place the silicon in the
socket with a vacuum pen or other chip lifting device. Pin 1 of the silicon
(denoted by an indented dot) should be in the bottom left hand corner, towards
the USB connector J33. Release the socket. The MC9S08AW60 silicon should
be centered within the socket and firmly held in place.
DEMO9S08AW60E User’s Guide, Rev. 0.3
Freescale Semiconductor
13
相关PDF资料 |
PDF描述 |
|---|---|
| DEMO9S08FL16 | BOARD DEMO FOR FL16 FAMI |
| DEMO9S08JM16 | BOARD DEMO FOR JM16 FAMI |
| DEMO9S08QD4 | BOARD DEMO FOR MC9S08QD FAMILY |
| DEMO9S08QE8 | BOARD DEMO FOR MC9S08Q |
| DEMO9S08SC4 | DEMO BOARD FOR 9S08SC4 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DEMO9S08DZ60 | 功能描述:开发板和工具包 - S08 / S12 9S08DZ60 DEMO BOARD RoHS:否 产品:Development Kits 工具用于评估:MC9S12G128 核心:S12 接口类型:CAN, LIN, RS-232, USB 工作电源电压:5 V 制造商:Freescale Semiconductor |
| DEMO9S08DZ60 | 制造商:Freescale Semiconductor 功能描述:9S08DZ60 DEMO BOARD |
| DEMO9S08EL32 | 功能描述:开发板和工具包 - S08 / S12 EL32 DEMO BOARD RoHS:否 产品:Development Kits 工具用于评估:MC9S12G128 核心:S12 接口类型:CAN, LIN, RS-232, USB 工作电源电压:5 V 制造商:Freescale Semiconductor |
| DEMO9S08EL32 | 制造商:Freescale Semiconductor 功能描述:MC9S08EL Demonstration board |
| DEMO9S08EL32AUTO | 功能描述:开发板和工具包 - S08 / S12 EL32 DEMO BOARD AUTO RoHS:否 产品:Development Kits 工具用于评估:MC9S12G128 核心:S12 接口类型:CAN, LIN, RS-232, USB 工作电源电压:5 V 制造商:Freescale Semiconductor |
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