参数资料
型号: DF3048VF10V
厂商: Renesas Electronics America
文件页数: 23/46页
文件大小: 0K
描述: MCU 3/5V 128K,PB-FREE 100-QFP
产品培训模块: Electromagnetic Noise Reduction Techniques Part 1
Digital to Analog Converter Part 1
Digital to Analog Converter Part 2
标准包装: 1
系列: H8® H8/300H
核心处理器: H8/300H
芯体尺寸: 16-位
速度: 10MHz
连通性: SCI,智能卡
外围设备: DMA,PWM,WDT
输入/输出数: 70
程序存储器容量: 128KB(128K x 8)
程序存储器类型: 闪存
RAM 容量: 4K x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 5.5 V
数据转换器: A/D 8x10b; D/A 2x8b
振荡器型: 内部
工作温度: -20°C ~ 75°C
封装/外壳: 100-BFQFP
包装: 托盘
H8
Architecture
M16C
Architecture
32-Bit RISC
Highest performance
Highest integration
32-Bit
Highest-performance
CISC
16-Bit
Broadest selection
of MCUs
16-Bit
Lowest-cost system
solution for 8-bit
applications
8-Bit
Lowest cost MCUs
with LCD driver
SH-4, SH-4A series
SH-3, SH3-DSP series
SH-2, SH2-DSP, SH-2A series
M32C/100 series
M16C/Tiny series
R8C/Tiny series
M32C/90 series
M32C/80 series
M16C/62P series
SuperH
Architecture
2006
H8S/SLP series
(20MHz)
H8S/Tiny series
(20MHz)
H8S series
(50MHz)
H8SX series
(100MHz)
2008
H8/Tiny series
(20MHz)
H8S series
(35MHz)
H8SX series
(50MHz)
H8/300H SLP series
(10MHz)
H8/300L SLP series
(16MHz)
Introduction
Renesas H8 Solutions
Speeds up to 50MHz, providing 50MIPS with single-cycle flash access
Single-voltage-programmable on-chip flash — 8KB to 1MB
Mask-ROM versions for many flash MCUs — 2KB to 512KB
Devices in the H8 series offer more than 100 different on-chip peripherals
Match peripheral set to application
Choose from timers, A/Ds, D/As, on-chip oscillators, low-voltage
detect, and DMA functions, among many others
UART, SPI, I
2C, IrDA, CAN, LIN, USB, Smart Card, LCD, POR, etc.
Super-low-power CMOS technology — 200A @ 1MHz, 0.4A @ 32kHz
Up to eight power-down modes
32kHz sub-clock oscillator
Improved technology and design techniques for a 20dB reduction
in noise compared to conventional products
Fully integrated tool suite of H/W and S/W tools
Highly optimized Renesas C/C++ compiler
100% upward code compatibility
Best in the industry
Experienced application engineers
Training courses and development tools available online at
www.renesasinteractive.com
Market Needs
High performance
Wide range of programmable memory
Wide range of low-cost memory
Integrated peripherals, including
support for industry-standard
interfaces
Low power consumption
Low radiation noise
Development environment
Cost/performance
Support and training
相关PDF资料
PDF描述
VI-J12-IW-B1 CONVERTER MOD DC/DC 15V 100W
VI-J1P-IW-B1 CONVERTER MOD DC/DC 13.8V 100W
VI-J11-IW-B1 CONVERTER MOD DC/DC 12V 100W
VE-J1M-IW-B1 CONVERTER MINIMOD DC/DC 10V 100W
V375A36C500BG3 CONVERTER MOD DC/DC 36V 500W
相关代理商/技术参数
参数描述
DF3048VF8V 功能描述:MCU 3/5V 128K,PB-FREE 100-QFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 标准包装:160 系列:S08 核心处理器:S08 芯体尺寸:8-位 速度:40MHz 连通性:I²C,LIN,SCI,SPI 外围设备:LCD,LVD,POR,PWM,WDT 输入/输出数:53 程序存储器容量:32KB(32K x 8) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:1.9K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:A/D 12x12b 振荡器型:内部 工作温度:-40°C ~ 105°C 封装/外壳:64-LQFP 包装:托盘
DF3048X16V 功能描述:MCU 5V 128K,PB-FREE 100-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 标准包装:160 系列:S08 核心处理器:S08 芯体尺寸:8-位 速度:40MHz 连通性:I²C,LIN,SCI,SPI 外围设备:LCD,LVD,POR,PWM,WDT 输入/输出数:53 程序存储器容量:32KB(32K x 8) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:1.9K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:A/D 12x12b 振荡器型:内部 工作温度:-40°C ~ 105°C 封装/外壳:64-LQFP 包装:托盘
DF3052BF25V 功能描述:IC H8/3052BF MCU FLASH 100QFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 标准包装:96 系列:PIC® 16F 核心处理器:PIC 芯体尺寸:8-位 速度:20MHz 连通性:I²C,SPI 外围设备:欠压检测/复位,POR,PWM,WDT 输入/输出数:11 程序存储器容量:3.5KB(2K x 14) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:128 x 8 电压 - 电源 (Vcc/Vdd):2.3 V ~ 5.5 V 数据转换器:A/D 8x10b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:14-TSSOP(0.173",4.40mm 宽) 包装:管件
DF3052BFI25V 制造商:Renesas Electronics Corporation 功能描述:MCU 5V 512K,PB-FREE 100-QFP - Trays
DF3052BX25V 功能描述:MCU 5V 512K 100-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 标准包装:160 系列:S08 核心处理器:S08 芯体尺寸:8-位 速度:40MHz 连通性:I²C,LIN,SCI,SPI 外围设备:LCD,LVD,POR,PWM,WDT 输入/输出数:53 程序存储器容量:32KB(32K x 8) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:1.9K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:A/D 12x12b 振荡器型:内部 工作温度:-40°C ~ 105°C 封装/外壳:64-LQFP 包装:托盘