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参数资料
型号： DF3069RF25V
厂商： Renesas Electronics America
文件页数： 45/46页
文件大小： 0K
描述： IC H8 MCU FLASH 128K 100QFP
产品培训模块： Electromagnetic Noise Reduction Techniques Part 1
Digital to Analog Converter Part 1
Digital to Analog Converter Part 2
标准包装： 1
系列： H8® H8/300H
核心处理器： H8/300H
芯体尺寸： 16-位
速度： 25MHz
连通性： SCI，智能卡
外围设备： DMA，PWM，WDT
输入/输出数： 70
程序存储器容量： 512KB（512K x 8）
程序存储器类型： 闪存
RAM 容量： 16K x 8
电压 - 电源 (Vcc/Vdd)： 4.5 V ~ 5.5 V
数据转换器： A/D 8x10b; D/A 2x8b
振荡器型： 内部
工作温度： -20°C ~ 75°C
封装/外壳： 100-BFQFP
包装： 托盘
产品目录页面： 742 (CN2011-ZH PDF)
6
H8
Family of Microcontrollers
■ Renesas: The #1
Flash MCU supplier
Renesas, the world’s #1
supplier of flash, has
shipped over 1 Billion
flash MCUs
Wide range of sizes of
highly reliable F-ZTAT
(flash) up to 1MB,
in 0.18m process
Fastest flash write time:
2.5 sec./ 128KB for
0.18m process
Access as fast as
10ns @ 100MHz
Up to -40°C to +125°C range
Multiple user-friendly modes for
programming/reprogramming
flash memory
User mode allows flash to be
programmed or erased by user
application software
Boot mode allows in-system
programming using RS-232
serial port
USB devices can be optionally
programmed via the USB port
User Boot mode allows storing
a custom flash update routine
in a special protected area
Write mode enables MCU
programming with desktop
or production programmers
Flash can be programmed via
the on-chip debug emulator
Next-Generation
Non-volatile
Memory
- MRAM
- PRAM
MONOS-type
FLASH
(MONOS = Metal
Oxide Nitride
Oxide Silicon)
80MHz
(0.2- 0.18m)
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
Stacked-type
(NOR) Flash HND
Memory Structure
NOR
80MHz
(150 nm)
NOR
50MHz
(180 nm)
MONOS
133MHz
(65nm)
166MHz
(45nm)
New
NVM
New
NVM
80MHz
100MHz
(150 nm)
MONOS
100MHz
(90nm)
MONOS
All Flash memory accesses are
single cycle, eliminating the
need for pre-fetch operations.
MRAM
80MHz
(130 nm)
NOR
TOP REASONS TO SELECT H8
Serial Transfers using DMA only
Parallel operation made possible
by using DMA + EXDMA allows
more data transfers in a given
length of time for increased
system throughput
Parallel Transfers using DMA + EXDMA
A1
A2
A3
B1
B2
A2
A1
A3
Bus Bridge
Internal Bus
Peripheral Bus
E
x
ter
nal
Bu
s
DMA
(4ch)
EXDMA
(Full Speed)
Flash
ROM
INTC
BSC
H8S CPU
RAM
DTC
Exter
n
al
SRAM
Exter
nal
Device
Time Saved
“A” Transfers
“B” Transfers
I/O Ports
Powerful Data Path
Management
H8 products are fully optimized system
solutions, so besides powerful CPU core
processing, H8 MCUs have advanced
data path management.
There are three types of data movement
engines: System DMA, External DMA
and Data Transfer Controller. The
Advanced
Bus
System
Controller
manages complex data and control
across the multiple-bus architecture.
The H8S and H8SX MCU architectures
use 3 separate buses. Data movement on
the External Bus and System Bus can
operate in parallel, greatly increasing
system
performance
by
optimizing
operation per clock cycle.
This example shows system operation (red) using the
System DMA, while in parallel the External DMA is
transferring data between an external device and the MCU
(yellow). This parallel operation reduces time for operation.
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相关代理商/技术参数
参数描述
DF3069RF25WV 制造商:Renesas Electronics 功能描述:Tray 制造商:Renesas 功能描述:0
DF3069RX25V 功能描述:IC H8/3069R MCU FLASH 100TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外围设备:DMA，POR，PWM，WDT 输入/输出数:121 程序存储器容量:384KB（384K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b，D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
DF3069RX25WV 功能描述:IC H8/3069R MCU FLASH 100TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外围设备:DMA，POR，PWM，WDT 输入/输出数:121 程序存储器容量:384KB（384K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b，D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
DF30AA120 制造商:SANREX 制造商全称:SanRex Corporation 功能描述:DIODE(THREE PHASES BRIDGE TYPE)
DF30AA160 制造商:SANREX 功能描述:BRIDGE RECTIFIER 3PH
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