参数资料
型号: DF3A6.8FUT1
厂商: ON Semiconductor
文件页数: 1/4页
文件大小: 0K
描述: TVS ZENER DUAL CA 20W SOT323
产品变化通告: Product Discontinuation 27/Jun/2007
标准包装: 10
电压 - 反向隔离(标准值): 5V
电压 - 击穿: 6.4V
功率(瓦特): 20W
电极标记: 2 通道阵列 - 单向
安装类型: 表面贴装
封装/外壳: SC-70,SOT-323
供应商设备封装: SC-70-3(SOT323)
包装: 剪切带 (CT)
工具箱: ZENESDA-KIT-ND - KIT ESD PROTECTION DEVICE DESIGN
其它名称: DF3A6.8FUT1OSCT
DF3A6.8FUT1
Preferred Device
Zener Transient Voltage
Suppressor
Dual Common Anode Zeners for ESD
Protection
http://onsemi.com
These dual monolithic silicon zener diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
anode design protects two separate lines using only one package. These
devices are ideal for situations where board space is at a premium.
Features
? Pb?Free Package is Available
? SC?70 Package Allows Two Separate Unidirectional Configurations
? Low Leakage < 1.0 m A @ 5.0 V
? Breakdown Voltage: 6.4?7.2 V @ 5.0 mA
? ESD Protection Meeting:16 kV Human Body Model
1
2
1
2
SC?70/SOT?323
CASE 419
STYLE 4
3
MARKING
DIAGRAM
68
?
?
30 kV Contact = IEC61000?4?2
Peak Power: 24 W @ 1.0 ms (Unidirectional), per Figure 1
Peak Power: 150 W @ 20 m s (Unidirectional), per Figure 2
68
M
= Specific Device Code
= Date Code
Mechanical Characteristics
ORDERING INFORMATION
?
?
?
?
Void Free, Transfer?Molded, Thermosetting Plastic Case
Corrosion Resistant Finish, Easily Solderable
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Device
DF3A6.8FUT1
DF3A6.8FUT1G
Package
SC?70
SC?70
(Pb?Free)
Shipping ?
3000/Tape & Reel
3000/Tape & Reel
MAXIMUM RATINGS
?For information on tape and reel specifications,
Rating
Steady State Power Dissipation
Derate above 25 ° C (Note 1)
Thermal Resistance Junction?to?Ambient
Operating Junction and Storage
Symbol
P D
R q JA
T J , T stg
Value
200
1.6
618
? 55 to
Unit
° mW °
mW/ ° C
° C/W
° C
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Temperature Range
+150
Peak Power Dissipation @ 1.0 ms
(Note 2) @ T A = 25 ° C
Peak Power Dissipation @ 20 m s (Note 3)
@ T A = 25 ° C
ESD Discharge
MIL STD 883C ? Method 3015?6
IEC61000?4?2, Air Discharge
IEC61000?4?2, Contact Discharge
P PK
P PK
V PP
20
150
16
30
30
W
W
kV
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. Mounted on FR?5 Board = 1.0 X 0.75 X 0.062 in.
2. Non?repetitive pulse per Figure 1.
3. Non?repetitive pulse per Figure 2.
? Semiconductor Components Industries, LLC, 2004
July, 2004 ? Rev. 1
1
Publication Order Number:
DF3A6.8FUT1/D
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