参数资料
型号: DFLS130-7
厂商: Diodes Inc
文件页数: 1/3页
文件大小: 100K
描述: DIODE SCHOTTKY 30V 1A POWERDI123
其它图纸: DFL(R,U,S,), SBR(2,3) Series Side
DFL(R,U,S,), SBR(2,3) Series Top
DFL(R,U,S,), SBR(2,3) Series Bottom
标准包装: 1
二极管类型: 肖特基
电压 - (Vr)(最大): 30V
电流 - 平均整流 (Io): 1A
电压 - 在 If 时为正向 (Vf)(最大): 420mV @ 1A
速度: 快速恢复 =< 500 ns,> 200mA(Io)
电流 - 在 Vr 时反向漏电: 1mA @ 30V
电容@ Vr, F: 40pF @ 10V,1MHz
安装类型: 表面贴装
封装/外壳: 2-SMD,扁平引线
供应商设备封装: PowerDI? 123
包装: 标准包装
产品目录页面: 1591 (CN2011-ZH PDF)
其它名称: DFLS130DIDKR
DFLS130
Document number: DS30445 Rev. 4 - 2
1 of 3
www.diodes.com
June 2008
? Diodes Incorporated
DFLS130
PowerDI is a registered trademark of Diodes Incorporated.
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER ?
123
PowerDI
Features
?
Guard Ring Die Construction for Transient Protection
?
Low Power Loss, High Efficiency
?
High Surge Capability
?
High Current Capability and Low Forward Voltage Drop
?
Lead Free Finish, RoHS Compliant (Note 5)
?
"Green" Molding Compound (No Br, Sb)
?
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
?
Case: PowerDI?123
?
Case Material: Molded Plastic.
UL Flammability Classification
Rating 94V-0
?
Moisture Sensitivity: Level 1 per J-STD-020D
?
Terminal Connections: Cathode Band
?
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
?
Marking Information: See Page 2
?
Ordering Information: See Page 2
?
Weight: 0.01 grams (approximate)
Top View
Maximum Ratings
@TA
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30
V
RMS Reverse Voltage
VR(RMS)
21
V
Average Forward Current
IF(AV)
1.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave Superimposed on Rated Load
IFSM
35
A
Thermal Characteristics
Characteristic
Symbol
Typ
Max
Unit
Power Dissipation (Note 1)
PD
?
1.67 W
Power Dissipation (Note 2)
PD
?
556
mW
Thermal Resistance Junction to Ambient (Note 1)
RθJA
?
60 °C/W
Thermal Resistance Junction to Ambient (Note 2)
RθJA
?
180
°C/W
Thermal Resistance Junction to Soldering (Note 3)
RθJS
?
10 °C/W
Electrical Characteristics
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 4)
V(BR)R
30
?
?
V
IR
= 1.5mA
Forward Voltage (Note 4)
VF
?
?
?
0.25
0.33
0.36
?
0.37
0.42
V
IF
= 0.1A
IF
= 0.7A
IF
= 1.0A
Leakage Current (Note 4)
IR
?
0.15 1.0
mA
VR
= 30V, T
A
= 25
°C
Total Capacitance
CT
?
40
?
pF
VR
= 10V, f = 1.0MHz
Notes: 1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode.
2. Part mounted on FR-4 board with 1.8mm X 2.
5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads.
3. Theoretical R
θJS
calculated from the top center of the die straight down to the
PCB cathode tab solder junction.
4. Short duration
pulse test used to minimize self-heating effect.
5. EU Directive 2002/95/
EC (RoHS). All applicable RoHS
exemptions applied, see
EU Directive 2002/95/EC Annex Notes.
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