参数资料
型号: DFLS230-7
厂商: Diodes Inc
文件页数: 1/3页
文件大小: 72K
描述: DIODE SCHOTTKY 2A 30V PWRDI 123
其它图纸: DFL(R,U,S,), SBR(2,3) Series Side
DFL(R,U,S,), SBR(2,3) Series Top
DFL(R,U,S,), SBR(2,3) Series Bottom
标准包装: 1
二极管类型: 肖特基
电压 - (Vr)(最大): 30V
电流 - 平均整流 (Io): 2A
电压 - 在 If 时为正向 (Vf)(最大): 490mV @ 2A
速度: 快速恢复 =< 500 ns,> 200mA(Io)
电流 - 在 Vr 时反向漏电: 1mA @ 30V
电容@ Vr, F: 75pF @ 10V,1MHz
安装类型: 表面贴装
封装/外壳: 2-SMD,扁平引线
供应商设备封装: PowerDI? 123
包装: 标准包装
产品目录页面: 1591 (CN2011-ZH PDF)
其它名称: DFLS230DIDKR
e3
DS30518 Rev. 2 - 1 1 of 3 DFLS230
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
Diodes Incorporated
DFLS230
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
123
PowerDI
B
A
A
C
E
L4
L
L1
E
H
D
L3
L2
L
Maximum Ratings
@ TA
= 25C unless otherwise specified
Guard Ring Die Construction for
Transient Protection
Low Power Loss, High Efficiency
Patented Interlocking Clip Design for High Surge Current
Capacity
Low Forward Voltage Drop
Lead Free Finish, RoHS Compliant (Note 5)
"Green" Molding Compound (No Br, Sb)
Mechanical Data
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30 V
RMS Reverse Voltage
VR(RMS)
21 V
Average Forward Current @ TT
= 120°C
IF(AV)
2.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
IFSM
40 A
Power Dissipation (Note 1)
PD
1.67 W
Power Dissipation (Note 2)
PD
556 mW
Thermal Resistance Junction to Ambient (Note 1)
RJA
60 °C/W
Thermal Resistance Junction to Ambient (Note 2)
RJA
180
C/W
Thermal Resistance Junction to Soldering (Note 3)
RJS
10 °C/W
Operating Temperature Range
Tj
-55 to +125
C
Storage Temperature Range
TSTG
-55 to +150 °C
Case: PowerDI123
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Marking & Type Code Information: See Last Page
Ordering Information: See Last Page
Weight: 0.01 grams (approximate)
Electrical Characteristics
@ TA
= 25C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 4)
V(BR)R
30
V
IR
= 1.5mA
Forward Voltage
VF
0.36
0.4
0.42
0.49
V
IF
= 1.0A
IF
= 2.0A
Leakage Current (Note 4)
IR
0.15 1.0 mA
VR
= 30V, TA
= 25C
Total Capacitance
CT
75
pF
VR
= 10V, f = 1.0MHz
Features
Notes: 1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode. TA
= 25C
= 25C
2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads. TA
3. Theoretical RJS
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Short duration pulse test to minimize self-heating effect.
5. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see
EU Directive Annex Note 7.
PowerDI123
Dim Min Max
Typ
A
3.50 3.90 3.70
B
2.60 3.00 2.80
C
1.63 1.93 1.78
D
0.93 1.00 0.98
E
0.85 1.25 1.00
H
0.15 0.25 0.20
L
0.45 0.85 0.65
L1
— — 1.35
L2
— — 1.10
L3
— — 0.20
L4
0.90 1.30 1.05
All Dimensions in mm
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