参数资料
| 型号： | DG4053AEN-T1-E4 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 12/18页 |
| 文件大小： | 0K |
| 描述： | IC MUX TRIPLE 2CHAN 16-MINIQFN |
| 标准包装： | 1 |
| 功能： | 多路复用器 |
| 电路： | 3 x 2:1 |
| 导通状态电阻： | 100 欧姆 |
| 电压电源： | 单/双电源 |
| 电压 - 电源，单路/双路(±)： | 2.7 V ~ 12 V，± 2.5 V ~ 5 V |
| 电流 - 电源： | -1µA，1µA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-WFQFN |
| 供应商设备封装： | 16-迷你型QFN（1.8x2.6） |
| 包装： | 标准包装 |
| 其它名称： | DG4053AEN-T1-E4DKR |
Document Number: 69828
S10-1383-Rev. E, 21-Jun-10
www.vishay.com
3
Vishay Siliconix
DG4051A, DG4052A, DG4053A
Notes:
a. Signals on SX, DX, or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
b. All leads welded or soldered to PC board.
c. Derate 5.6 mW/°C above 70 °C.
d. Derate 6.6 mW/°C above 70 °C.
e. Manual soldering with iron is not recommended for leadless components. The miniQFN-16 is a leadless package. The end of the lead terminal
is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper lip cannot be
guaranteed and is not required to ensure adequate bottom side solder interconnection.
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Limit
Unit
V+ to V-
14
V
GND to V-
7
Digital Inputsa, VS, VD
(V-) - 0.3 to (V+) + 0.3
or 30 mA, whichever occurs first
Continuous Current (Any terminal)
30
mA
Peak Current, S or D (Pulsed 1 ms, 10 % duty cycle)
100
Storage Temperature
- 65 to 150
°C
Power Dissipationb
16-Pin TSSOPc
450
mW
16-Pin miniQFNd, e
525
Thermal Resistanceb
16-Pin TSSOP
178
°C/W
16-Pin miniQFNe
152
SPECIFICATIONS FOR DUAL SUPPLIES
Parameter
Symbol
Test Conditions
Unless Otherwise Specified
VCC = + 5 V, VEE = - 5 V
VIN(A, B, C and ENABLE) = 2.0 V, 0.8 V
a
Temp.b
Typ.c
- 40 °C to 125 °C - 40 °C to 85 °C
Unit
Min.d
Max.d
Min.d
Max.d
Analog Switch
Analog Signal Rangee
VANALOG
Full
- 55- 55
V
On-Resistance
RON
IS = 1 mA, VD = - 3 V, 0 V, + 3 V
Room
Full
66
100
125
100
118
On-Resistance Match
R
ON
IS = 1 mA, VD = ± 3 V
Room
Full
36
10
6
8
On-Resistance
Flatness
RFLATNESS
IS = 1 mA, VD = - 3 V, 0 V, + 3 V
Room
Full
12
16
20
16
18
Switch Off
Leakage Current
IS(off)
V+ = 5.5 V, V- = - 5.5 V,
VD = ± 4.5 V, VS =
4.5 V
Room
Full
± 0.02
- 1
- 50
1
50
- 1
- 5
1
5
nA
ID(off)
Room
Full
± 0.02
- 1
- 50
1
50
- 1
- 5
1
5
Channel On
Leakage Current
ID(on)
V+ = 5.5 V, V- = - 5.5 V,
VS = VD = ± 4.5 V
Room
Full
± 0.02
- 1
- 50
1
50
- 1
- 5
1
5
Digital Control
Input Current, VIN Low
IIL
VIN(A, B, C and ENABLE)
under test = 0.8 V
Full
0.01
- 11- 11
A
Input Current, VIN High
IIH
VIN(A, B, C and ENABLE)
under test = 2.0 V
Full
0.01
- 11- 11
Input Capacitancee
CIN
f = 1 MHz
Room
3.4
pF
Dynamic Characteristics
Off Isolation
OIRR
RL = 50 , CL = 1 pF
f = 10 MHz
Room
67
dB
f = 100 MHz
Room
46
Channel-to-Channel
Crosstalk
XTALK
f = 10 MHz
Room
67
f = 100 MHz
Room
47
Bandwith, 3 dB
BW
RL = 50
DG4051A
Room
330
MHz
DG4052A
Room
450
DG4053A
Room
730
±
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