参数资料
| 型号： | DM183021 |
| 厂商： | Microchip Technology |
| 文件页数： | 17/46页 |
| 文件大小： | 0K |
| 描述： | BOARD DEV PICDEM MC LV |
| 标准包装： | 1 |
| 系列： | PICDEM™ |
| 主要目的： | 电源管理，电机控制 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | PIC18F，dsPIC30F |
| 主要属性： | 3 相无刷 DC（BLDC）电机，1A，LIN，SPI，PWM 接口 |
| 次要属性： | 图形用户界面 |
| 已供物品： | 板，软件 |
| 产品目录页面： | 659 (CN2011-ZH PDF) |
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System Level Architecture of the Board
2.3.4
Hall Sensor Interface
Hall sensors on the motor are open-collector outputs. Individual pull-up resistors are
provided on the board for each Hall sensor. The Hall sensor signals, HA, HB and HC,
are connected to the input capture pins, IC1, IC2 and IC3, respectively.
2.3.5
Back EMF Signal Conditioning
When a sensorless algorithm is used to control the BLDC motor speed, Back EMF
(BEMF) signals are used. Based on zero crossing of BEMF signals, motor com-
mutation is decided in the firmware. The signal conditioning circuit has mainly two
blocks: the first is a low-pass filter for each phase voltage and the second is a
comparator circuit for determining the zero crosspoint. When using the PIC18F MCU,
the jumpers are set to use both of these blocks. The output is connected to the input
capture pins, IC1, IC2 and IC3. When a dsPIC30F DSC is used, the low-pass filters are
used in the circuit. Using the on-chip Analog-to-Digital Converters, the BEMF zero
crosspoint is determined. In order to configure this, the board has 8 jumpers. Refer to
and dsPIC30F, respectively. Also, refer to Appendix C. “Jumper Settings” for the
complete list of jumper settings. In addition, the silk screen on the non-component side
of the board has the jumper settings printed for quick reference.
2.3.6
Temperature Measurement Circuit
A temperature sensor is placed next to the PCB heat sink near Q5. The sensor,
Microchip’s TC74, has an I 2 C? interface. It measures the temperature and converts it
to a digital value. This value can be read using the I 2 C protocol. The code on the CD
does not include the temperature reading routines. The routines for the Master mode
I 2 C, using the SSP module, can be found on Microchip’s web site.
Note:
When using the temperature sensor, jumpers J16 and J17 should be open.
When the temperature sensor is used, LEDs D2 and D3 are not available.
2.4
POWER INVERTER SECTION
The inverter section consists of three half-bridge gate drivers and three phase inverter
bridges using MOSFETs. Figure 2-2 shows a half-bridge gate driver and half-bridge
inverter. This circuit is repeated for each motor phase winding. PWM pairs,
PWM0-PWM1, PWM2-PWM3 and PWM4-PWM5, control three half-bridge inverters.
The DC bus is either derived from the 24V power supply connected to the input
connector J20, or from the ‘+’ and ‘–’ terminals on connector J9.
FIGURE 2-2:
HALF-BRIDGE GATE DRIVER AND INVERTER
DC+
Q1
PWM1
PWM1
? 2006 Microchip Technology Inc.
PWM0
Driver
IR2101
PWM0
Q0
DC-
M1
DS51554B-page 13
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PDF描述 |
|---|---|
| DM183033 | BOARD DEMO INTERNET RADIO |
| DM240314 | BOARD DEV LCD EXPLORER |
| DM240415 | ACCESSORY DEVELOPMENT START KIT |
| DM300004-2 | BOARD DEMO DSPICDEM.NET 2 |
| DM300014 | BOARD DEMO DSPICDEM 1.1 GEN PURP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DM183022 | 功能描述:开发板和工具包 - PIC / DSPIC PICDEM EXPLORER BRD RoHS:否 制造商:Microchip Technology 产品:Starter Kits 工具用于评估:chipKIT 核心:Uno32 接口类型: 工作电源电压: |
| DM183022 | 制造商:Microchip Technology Inc 功能描述:MICROCONTROLLER DEVELOPMENT TOOL |
| DM183022 | 制造商:Microchip Technology Inc 功能描述:EXPLORER BOARD KIT PICDEM HPC |
| DM183023 | 功能描述:Zigbee/802.15.4开发工具 ZENA Network Analyzer RoHS:否 制造商:Silicon Labs 产品:Development Kits 工具用于评估:EM35x 频率:2.4 GHz 接口类型:USB 工作电源电压: |
| DM183023 | 制造商:Microchip Technology Inc 功能描述:ZENA Network Analyzer |
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