参数资料
| 型号： | DPAM-30-07.0-H-3-2-A |
| 厂商： | Samtec Inc |
| 文件页数： | 1/1页 |
| 文件大小： | 0K |
| 描述： | CONN ARRAY DIFF MALE 3X30PAIR |
| 标准包装： | 1 |
| 系列： | DP Array® DPAM |
| 连接器类型： | 差分对阵列，公 |
| 位置数： | 168 信号（84 对） |
| 间距： | 0.085"（2.16mm） |
| 行数： | 3 |
| 安装类型： | 表面贴装 |
| 特点： | 板导轨 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 30µin（0.76µm） |
| 包装： | 托盘 |
| 配接层叠高度： | 10mm |
| 板上方高度： | 0.262"（6.66mm） |
| 其它名称： | SAM8051 |
F-214
DPAM–23–07.0–S–8–2–A
(2,16 mm) .085"
?
DPAF–23–03.0–S–8–2–A
DPAM, DPAF SERIES
HIGH DENSITY DIFFERENTIAL PAIR ARRAY
DPAM Mates with:
DPAF
DPAF Mates with:
DPAM
PAIRS
PER ROW
07.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
OPTION
DPAM
SPECIFICATIONS
For complete speci?cations and
recommended PCB layouts see
www.samtec.com?DPAM or
www.samtec.com?DPAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au over 50μ" (1,27 μm) Ni
Current Rating (2x3):
2.9 A per pin
– 04, –06
– 08, –15, –23
G1
–S
=30μ" (0,76 μm)
Gold on contact area,
Tin on solder tail
Perimeter
Grounds (TYP)
(2,54)
.100
–8
=Eight
Pair
Rows
–3
=Three
Pair
Rows
–2
= Lead-Free
Tin Alloy
96.5% Sn/
3% Ag/.5% Cu
Solder Crimp
–K
=(20,00 mm) 0.80"
DIA Polyimide
?lm Pick &
Place Pad
–TR
=Tape & Reel
–GP
=Guide Post
Operating Temp Range:
-55°C to +125°C
A
(–23 only)
Signal Pairs (TYP)
Rated @ 3dB Insertion Loss*
Contact Resistance:
10.4m Ω
Working Voltage:
300 VAC
Mated Cycles: 100 Cycles
RoHS Compliant: Yes
Lead-Free Solderable: Yes
NO OF
ROWS
–8
–3
A
(24,59) .968
(11,89) .468
02 01 G2 03 04
No. of positions x (2,16) .085 + (4,34) .171
(6,66)
.262
(2,54)
.100
(0,13)
.005
DPAM/DPAF
10 mm Stack Height
Single-Ended Signaling 8 GHz / 16 Gbps
RECOGNITIONS
Differential Pair Signaling 7 GHz / 14 Gbps
(2,16) .085
For complete scope of
recognitions see
www.samtec.com/quality
(1,27)
.050
(1,27)
.050
(1,08) .0425 DIA
No. of positions x (2,16) .085 + (2,95) .116
*Performance data includes effects of a non-optimized PCB.
Complete test data available at www.samtec.com?DPAM,
www.samtec.com?DPAF or contact sig@samtec.com
roto rted
cols
o
Supp
Fibre Chann
MGT (Rocke
Download app
mtec.com/app om
G @ samtec.c
on protocols
DPAF
03.0
– 04, – 06, – 08,
–15, –23
ROWS
(23,32)
A
–8
02 (2,54)
.100
01 (10,62)
–3
(1,27) .050
MATED
STYLE
–03.0
A
SIZE
P
el
Rapid I/O ?
PCI Express
SATA ?
InfiniBand
XAUI
t I/O)
notes at
note
www.sa
Contact SI
for questions
ALSO AVAILABLE
(MOQ Required)
? Tin-Lead Solder Charge
? Other platings
Contact Samtec.
(1,52)
.060
PAIRS PLATING NO. OF
PER ROW OPTION ROWS
–S =Eight
Gold on contact area,
No. of positions x (2,16) .085 + (4,34) .171
G1 Signal
Pairs
04
G2 03
Perimeter Grounds (TYP)
.254 .005
–8
=30μ" (0,76 μm) Pair Rows
Tin on solder tail –3
=Three
Pair Rows
(TYP) NO OF
A
.918
.418
DPAF
DPAM
(6,45) (0,13) LEAD HEIGHT*
SOLDER
TYPE
–2
= Lead-Free Tin Alloy
96.5% Sn/ 3%Ag/
.5% Cu
Solder Crimp
USABLE PAIRS
PER ARRAY*
–04 x –3 6 Pairs
–06 x –3 12 Pairs
–04 x –8 16 Pairs
–06 x –8 32 Pairs
–08 x –8 48 Pairs
–15 x –8 104 Pairs
–23 x –8 168 Pairs
–08 x –3 18 Pairs
OPTION
–K
=(20,00 mm)
0.80" DIA
Polyimide
?lm
Pick &
Place Pad
–TR
=Tape
& Reel
(1,08) .0425
Note: Patented
Note: Some sizes, styles and
options are non-standard,
non-returnable.
(1,27)
.050
(2,16) .085
Solder crimped on tail
No. of positions x (2,16) .085 + (2,95) .116
(1,27)
.050
DIA
–07.0 10 mm
*Processing
conditions will
affect mated height.
–15 x –3 39 Pairs
–23 x –3 63 Pairs
*Assumes ?rst and last pair in
each row are grounded
WWW.SAMTEC.COM
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