参数资料
| 型号： | DRDC3105E6-7 |
| 厂商： | Diodes Inc |
| 文件页数： | 2/9页 |
| 文件大小： | 0K |
| 描述： | IC RELAY DRVR INDUCTIVE 6-SOT26 |
| 标准包装： | 1 |
| 类型： | 继电/负载驱动器 |
| 输入类型： | 非反相 |
| 输出数： | 2 |
| 电流 - 输出 / 通道： | 430mA |
| 电源电压： | 3 V ~ 5 V |
| 工作温度： | -55°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 |
| 供应商设备封装： | SOT-26 |
| 包装： | 标准包装 |
| 其它名称： | DRDC3105E6-7DIDKR |
A Product Line of
Diodes Incorporated
DRDC3105
Internal Device Schematic
Maximum Ratings (@T A = +25°C, unless otherwise specified.)
Characteristic
Supply Voltage
Input Voltage (Forward)
Input Voltage (Reverse)
Output Sink Continuous Current
Repetitive Pulse Zener Energy Limit (Duty Cycle 0.01%)
Symbol
V CC
V IN(FWD)
V IN(REV)
I O
E zpk
Limit
6.0
6.0
-0.5
500
50
Unit
V
V
V
mA
mJ
Thermal Characteristics for DRDC3105F (SOT23) (@T A = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Leads
Operating and Storage Temperature Range
(Note 5)
(Note 6)
(Note 5)
(Note 6)
(Note 11)
P D
R θ JA
R θ JL
T J, T STG
310
350
403
357
350
-55 to +150
mW
°C/W ?
°C/W ?
°C
Thermal Characteristics for DRDC3105E6 (SOT26) (@T A = +25°C, unless otherwise specified.)
Characteristic
(Note 7 & 9)
Symbol
Value
0.9
7.2
Unit
Power Dissipation
Linear Derating Factor
(Note 7 & 10)
P D
1.1
8.8
W
mW/°C
(Note 8 & 10)
(Note 7 & 9)
1.7
13.6
139
Thermal Resistance, Junction to Ambient
(Note 7 & 10)
R θ JA
113
°C/W ?
(Note 8 & 10)
73
Thermal Resistance, Junction to Leads
Operating and Storage Temperature Range
(Note 11)
R θ JL
T J , T STG
100
-55 to +150
°C/W ?
°C
Notes:
5. For a device mounted on minimum recommended pad layout 1oz weight copper that is on a single-sided FR4 PCB; device is measured under still air
conditions whilst operating in a steady-state.
6. Same as Note 5, except the device is mounted on 15mm X 15mm 1oz copper.
7. Same as Note 5, except the device is mounted on 25mm X 25mm 1oz copper.
8. Same as Note 7, except the device is measured at < 5sec
9. For a device with one active die.
10. For a device with two die running at equal power.
11. Thermal resistance from junction to solder-point (at the end of the “OUT” lead).
?
DRDC3105
Document number: DS35213 Rev. 4 - 2
2 of 9
March 2013
? Diodes Incorporated
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