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参数资料
型号： DRV401AIRGWRG4
厂商： TEXAS INSTRUMENTS INC
元件分类： 模拟信号调理
英文描述： SPECIALTY ANALOG CIRCUIT, PQCC20
封装： 5 X 5 MM, GREEN, PLASTIC, QFN-20
文件页数： 12/36页
文件大小： 963K
代理商： DRV401AIRGWRG4
DRV401
SBVS070B JUNE 2006 REVISED MAY 2009
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage
+7V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signal Input Terminals:
Voltage(2)
0.5V to VDD + 0.5V
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential Amplifier(3)
10V to +10V
. . . . . . . . . . . . . . . . . . . . . .
Current at IS1 and IS2
±75mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current (pins other than IS1 and IS2)(2)
±25mA
. . . . . . . . . . . . . .
ICOMP Short Circuit(4)
+250mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Junction Temperature
50
°C to +150°C
. . . . . . . . . . . . .
Storage Temperature
55
°C to +150°C
. . . . . . . . . . . . . . . . . . . . . . .
ESD Rating:
Human Body Model (HBM)
Pins IAIN1 and IAIN2 Only
1kV
. . . . . . . . . . . . . . . . . . . . . . . . . . .
All Other Pins
4kV
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply
rails must be current limited, except for the differential amplifier
input pins.
(3) These inputs are not internally protected against over voltage.
The differential amplifier input pins must be limited to 5mA, max or
±10V, max.
(4) Power-limited; observe maximum junction temperature.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
PACKAGE
MARKING
DRV401
QFN-20
(5mm x 5mm)
RGW
HAAQ
DRV401
SO-20
DWP
DRV401A
(1) For the most current package and ordering information see the
Package Option Addendum at the end of this document, or see
the TI web site at www.ti.com.
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