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参数资料
| 型号： | DRV8825PWP |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 运动控制电子 |
| 英文描述： | BRUSH DC MOTOR CONTROLLER, PDSO28 |
| 封装： | GREEN, PLASTIC, HTSSOP-28 |
| 文件页数： | 18/22页 |
| 文件大小： | 628K |
| 代理商： | DRV8825PWP |
SLVSA73C
– APRIL 2010 – REVISED MAY 2011
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VALUE
UNIT
VMx
Power supply voltage range
–0.3 to 47
V
Digital pin voltage range
–0.5 to 7
V
VREF
Input voltage
–0.3 to 4
V
ISENSEx pin voltage
–0.3 to 0.8
V
Peak motor drive output current, t
< 1 μS
Internally limited
A
Continuous motor drive output current(3)
2.5
A
HBD (human body model)
2000
ESD rating
V
CDM (charged device model)
500
Continuous total power dissipation
See Dissipation Ratings table
TJ
Operating virtual junction temperature range
–40 to 150
°C
TA
Operating ambient temperature range
–40 to 85
°C
Tstg
Storage temperature range
–60 to 150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
Power dissipation and thermal limits must be observed.
THERMAL INFORMATION
DRV8825
THERMAL METRIC(1)
PWP
UNITS
28 PINS
θJA
Junction-to-ambient thermal resistance(2)
31.6
θJCtop
Junction-to-case (top) thermal resistance(3)
15.9
θJB
Junction-to-board thermal resistance(4)
5.6
°C/W
ψJT
Junction-to-top characterization parameter(5)
0.2
ψJB
Junction-to-board characterization parameter(6)
5.5
θJCbot
Junction-to-case (bottom) thermal resistance(7)
1.4
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7)
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VM
Motor power supply voltage range(1)
8.2
45
V
VREF
VREF input voltage(2)
1
3.5
V
IV3P3
V3P3OUT load current
0
1
mA
fPWM
Externally applied PWM frequency
0
100
kHz
(1)
All VM pins must be connected to the same supply voltage.
(2)
Operational at VREF between 0 V and 1 V, but accuracy is degraded.
Copyright
2010–2011, Texas Instruments Incorporated
5
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