参数资料
型号: DS10BR254TSQ/NOPB
厂商: National Semiconductor
文件页数: 10/16页
文件大小: 0K
描述: IC LVDS REPEAT 1.5GBPS 1:4 40LLP
标准包装: 1
类型: 转发器
Tx/Rx类型: LVDS
延迟时间: 440ps
电容 - 输入: 1.7pF
电源电压: 3 V ~ 3.6 V
电流 - 电源: 135mA
安装类型: 表面贴装
封装/外壳: 40-WFQFN 裸露焊盘
供应商设备封装: 40-LLP-EP(6x6)
包装: 标准包装
产品目录页面: 1275 (CN2011-ZH PDF)
其它名称: DS10BR254TSQDKR
SNLS260D – DECEMBER 2007 – REVISED APRIL 2013
PIN DESCRIPTIONS
Pin
Pin Name
I/O, Type
Pin Description
Number
IN1+, IN1-,
4, 5,
I, LVDS
Inverting and non-inverting high speed LVDS input pins.
IN2+, IN2-,
6, 7,
OUT0+, OUT0-,
29, 28,
O, LVDS
Inverting and non-inverting high speed LVDS output pins.
OUT1+, OUT1-,
27, 26,
OUT2+, OUT2-,
24, 23,
OUT3+, OUT3-
22, 21
SEL_in
14
I, LVCMOS
This pin selects which LVDS input is active.
LOS1,
37,
O, LVCMOS
Loss Of Signal output pins, LOSn report when an open input fault condition is
LOS2
36
detected at the input, INn. These are open drain outputs. External pull up
resistors are required.
PWDN0,
35,
I, LVCMOS
Channel output power down pin. When the PWDNn is set to L, the channel
PWDN1,
34
output OUTn is in the power down mode.
PWDN2,
33,
PWDN3
32
PWDN
38
I, LVCMOS
Device power down pin. When the PWDN is set to L, the device is in the
power down mode.
VDD
3, 8,
Power
Power supply pins.
15,25, 30
GND
16, DAP
Power
Ground pin and a pad (DAP - die attach pad).
NC
1, 2
NC
NO CONNECT pins. May be left floating.
9, 10,
11, 12,
13, 17,
18, 19,
20, 31,
39, 40
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Copyright 2007–2013, Texas Instruments Incorporated
3
Product Folder Links: DS10BR254
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