参数资料
型号: DS1222S
厂商: Maxim Integrated
文件页数: 1/4页
文件大小: 0K
描述: IC BANKSWITCH CMOS 16-SOIC
标准包装: 1
控制器类型: 静态 RAM(SRAM)
电源电压: 4.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC W
包装: 管件
1 of 4
111899
FEATURES
Provides bank switching for 16 banks of
memory
Bank switching is software-controlled by a
pattern recognition sequence on four address
inputs
Automatically sets all 16 banks off on
power-up
Bank switching logic allows only one bank on
at a time
Custom recognition patterns are available to
prevent unauthorized access
Full
±10% operating range
Low-power CMOS circuitry
Can be used to expand the address range of
microprocessors and decoders
Optional 16-pin SOIC surface mount package
PIN ASSIGNMENT
PIN DESCRIPTION
AW-AZ
- Address Inputs
CEI
- Chip Enable Input
CEO
- Chip Enable Output
NC
- No Connection
BS1,BS2,
- Bank Select Outputs
BS3,BS4
- Bank Select Outputs
I
PF
- Power Fail Input
VCC
- +5 Volts
GND
- Ground
DESCRIPTION
The DS1222 BankSwitch Chip is a CMOS circuit designed to select one of 16 memory banks under
software control. Memory bank switching allows for an increase in memory capacity without additional
address lines. Continuous blocks of memory are enabled by selecting proper memory bank through a
pattern recognition sequence on four address inputs. Custom patterns from Dallas Semiconductor can
provide security through uniqueness and prevent unauthorized access. By combining the DS1222 with
the DS1212 Nonvolatile Controller x16 Chip, up to 16 banks of static RAMs can be selected.
DS1222
BankSwitch Chip
www.dalsemi.com
DS1222 14-Pin DIP
(300-mil)
See Mech. Drawings
Section
CEI
VCC
13
AW
AY
GND
CEO
BS1
BS2
BS3
BS4
NC
1
2
3
4
5
6
7
14
12
11
10
9
8
PFI
AX
AZ
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VCC
CEO
NC
BS1
BS2
BS3
NC
BS4
CEI
NC
PFI
AW
AX
AY
AZ
GND
DS1222S 16-Pin SOIC
(300-mil)
See Mech. Drawings
Section
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DS1222S+ 功能描述:IC BANKSWITCH CMOS 16-SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 - 控制器 系列:- 标准包装:45 系列:- 控制器类型:静态 RAM(SRAM) 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 封装/外壳:16-SOIC(0.295",7.50mm 宽) 供应商设备封装:16-SOIC W 包装:管件
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