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参数资料
| 型号： | DS12CR887-33+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 14/23页 |
| 文件大小： | 0K |
| 描述： | IC RTC W/RAM 128 BYTE 24-EDIP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 31 |
| 类型： | 时钟/日历 |
| 特点： | 警报器，闰年，NVSRAM，方波输出，涓流充电器 |
| 存储容量： | 114B |
| 时间格式： | HH:MM:SS（12/24 小时） |
| 数据格式： | YY-MM-DD-dd |
| 接口： | 并联 |
| 电源电压： | 2.97 V ~ 3.63 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 24-DIP 模块（0.600"，15.24mm） |
| 供应商设备封装： | 24-EDIP |
| 包装： | 管件 |
| 产品目录页面： | 1433 (CN2011-ZH PDF) |
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
21
Maxim Integrated
Handling, PC Board Layout,
and Assembly
The EDIP and BGA packages contain a quartz tuning-
fork crystal. Pick-and-place equipment can be used,
but precautions should be taken to ensure that exces-
sive shocks are avoided. Ultrasonic cleaning should be
avoided to prevent damage to the crystal.
The BGA package can be reflowed as long as the fol-
lowing conditions are met:
1. Preheating (below +160°C) is within 90 seconds.
2. Maximum time above +150°C is less than 180 seconds.
3. Maximum time above +170°C is less than 100 seconds.
4. Maximum time above +200°C is less than 60 seconds.
5. Maximum time above +220°C is less than 30 seconds.
6. Peak temperature is less than or equal to +225°C.
Exposure to reflow is limited to two times maximum.
Moisture-sensitive packages are shipped from the
factory dry-packed. Handling instructions listed on the
package label must be followed to prevent damage dur-
ing reflow. Refer to the IPC/JEDEC J-STD-020 standard
for Moisture-Sensitive Device (MSD) classifications.
The EDIP (DS12CR887) module can be successfully
processed through conventional wave-soldering tech-
niques so long as temperature exposure to the lithium
energy source does not exceed +85°C. Post-solder
cleaning with water-washing techniques is acceptable,
provided that ultrasonic vibration is not used. Such
cleaning can damage the crystal.
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
VCC
SQW
N.C.
RCLR
AD0
X2
X1
MOT
TOP VIEW
VBACKUP
IRQ
RESET
DS
AD4
AD3
AD2
AD1
16
15
14
13
9
10
11
12
GND
R/W
AS
CS
GND
AD7
AD6
AD5
SO (0.300")
DS12R885
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
VCC
SQW
N.C.
AD0
N.C.
MOT
N.C.
IRQ
RESET
DS
AD4
AD3
AD2
AD1
16
15
14
13
9
10
11
12
N.C.
R/W
AS
CS
GND
AD7
AD6
AD5
EDIP (0.700")
DS12CR887
Pin Configurations
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| MCP4641T-503E/ML | IC DGTL POT 50K 256TAPS 16-QFN |
| DS12887A+ | IC RTC W/RAM 128 BYTE 24-EDIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DS12CR887-33+ | 功能描述:实时时钟 RTC w/Constant V Trickle Charger RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS12CR887-5 | 功能描述:实时时钟 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS12CR887-5+ | 功能描述:实时时钟 RTC w/Constant V Trickle Charger RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS12R885-33 | 制造商:Maxim Integrated Products 功能描述:REAL TIME CLOCK MULTIPLEXED 114BYTE - Bulk |
| DS12R885-5 | 制造商:Maxim Integrated Products 功能描述:REAL TIME CLOCK MULTIPLEXED 114BYTE - Bulk |
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