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参数资料
| 型号： | DS1307ZN+T&R/C02 |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/14页 |
| 文件大小： | 0K |
| 描述： | IC RTC SERIAL IND 8-SOIC |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 时钟/日历 |
| 特点： | 闰年，NVSRAM，方波输出 |
| 存储容量： | 56B |
| 时间格式： | HH:MM:SS（12/24 小时） |
| 数据格式： | YY-MM-DD-dd |
| 接口： | I²C，2 线串口 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 电压 - 电源，电池： | 2 V ~ 3.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 带卷 (TR) |
| 其它名称： | 90-1307Z+C02 |
DS1307 64 x 8, Serial, I2C Real-Time Clock
7 of 14
OSCILLATOR CIRCUIT
The DS1307 uses an external 32.768kHz crystal. The oscillator circuit does not require any external resistors or
capacitors to operate. Table 1 specifies several crystal parameters for the external crystal. Figure 1 shows a
functional schematic of the oscillator circuit. If using a crystal with the specified characteristics, the startup time is
usually less than one second.
CLOCK ACCURACY
The accuracy of the clock is dependent upon the accuracy of the crystal and the accuracy of the match between
the capacitive load of the oscillator circuit and the capacitive load for which the crystal was trimmed. Additional
error will be added by crystal frequency drift caused by temperature shifts. External circuit noise coupled into the
oscillator circuit may result in the clock running fast. Refer to Application Note 58: Crystal Considerations with
Dallas Real-Time Clocks for detailed information.
Table 1. Crystal Specifications*
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
Nominal Frequency
fO
32.768
kHz
Series Resistance
ESR
45
k
Load Capacitance
CL
12.5
pF
*The crystal, traces, and crystal input pins should be isolated from RF generating signals. Refer to
Application Note 58: Crystal Considerations for Dallas Real-Time Clocks for additional specifications.
Figure 2. Recommended Layout for Crystal
RTC AND RAM ADDRESS MAP
Table 2 shows the address map for the DS1307 RTC and RAM registers. The RTC registers are located in address
locations 00h to 07h. The RAM registers are located in address locations 08h to 3Fh. During a multibyte access,
when the address pointer reaches 3Fh, the end of RAM space, it wraps around to location 00h, the beginning of
the clock space.
NOTE: AVOID ROUTING SIGNAL LINES IN THE CROSSHATCHED
AREA (UPPER LEFT QUADRANT) OF THE PACKAGE UNLESS
THERE IS A GROUND PLANE BETWEEN THE SIGNAL LINE AND THE
DEVICE PACKAGE.
LOCAL GROUND PLANE (LAYER 2)
CRYSTAL
X1
X2
GND
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相关代理商/技术参数 |
参数描述 |
|---|---|
| DS1308 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Low-Current I2C RTC with 56-Byte NV RAM |
| DS1308N | 制造商:DALLAS 制造商全称:Dallas Semiconductor 功能描述:64 X 8 Serial Real Time Clock |
| DS1308U-18 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Low-Current I2C RTC with 56-Byte NV RAM |
| DS1308U-18+ | 功能描述:实时时钟 LOW CUR 1.8V I2C RTC RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1308U-18+T | 功能描述:实时时钟 LOW CUR 1.8V I2C RTC RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
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