参数资料
型号: DS1321S/T&R
厂商: Maxim Integrated
文件页数: 10/13页
文件大小: 0K
描述: IC CTRLR NV W/BATT MON 5V 16SOIC
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
控制器类型: 非易失性 RAM
电源电压: 4.75 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: 16-SOIC
包装: 带卷 (TR)
DS1321
6 of 13
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground
-0.5V to +6.0V
Operating Temperature Range
-40°C to +85°C
Storage Temperature Range
-55°C to +125°C
Soldering Temperature (reflow, SO or TSSOP)
+260°C
Lead Temperature (soldering, 10s)
+300°C
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of
time may affect reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PDIP
Junction-to-Ambient Thermal Resistance (θJA).…………………...………………………......95°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………35°C/W
SO
Junction-to-Ambient Thermal Resistance (θJA).…………………...………………………......75°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………24°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θJA).……………………………………………..73.8°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………20°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board
for the SMT packages. For detailed information on package thermal considerations, refer to
RECOMMENDED OPERATING CONDITIONS
(-40°C to +85°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Supply Voltage TOL=GND
VCCI
4.75
5.0
5.5
V
2
Supply Voltage TOL=VCCO
VCCI
4.5
5.0
5.5
V
2
Battery Supply Voltage
VBAT
2.0
3.0
6.0
V
2
Logic 1 Input
VIH
2.0
VCCI+0.3
V
2. 13
Logic 0 Input
VIL
-0.3
+0.8
V
2, 13
DC ELECTRICAL CHARACTERISTICS
(-40°C to +85°C; VCCI ≥ VCCTP)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Operating Current (TTL inputs)
ICC1
1
1.5
mA
3
Operating Current (CMOS inputs)
ICC2
100
150
A
3, 6
RAM Supply Voltage
VCCO
VCC1
-0.2
V
2
RAM Supply Current
(VCCO ≥ VCCI -0.2V)
ICCO1
185
mA
4
Supply Current
(VCCO ≥ VCCI -0.3V)
ICCO2
260
mA
5
VCC Trip Point (TOL=GND)
VCCTP
4.50
4.62
4.75
V
2
VCC Trip Point (TOL=VCCO)
VCCTP
4.25
4.37
4.50
V
2
VBAT Trip Point
VBTP
2.50
2.6
2.70
V
2
Output Current @ 2.2V
IOH
-1
mA
8, 11
Output Current @ 0.4V
IOL
4
mA
8, 11
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