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参数资料
| 型号： | DS1386-8-120+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 7/21页 |
| 文件大小： | 0K |
| 描述： | IC TIMEKEEPER RAM 64K 32-EDIP |
| 标准包装： | 11 |
| 类型： | 时钟/日历 |
| 特点： | 警报器，闰年，NVSRAM，方波输出，监视计时器 |
| 存储容量： | 8KB |
| 时间格式： | HH:MM:SS:hh（12/24 小时） |
| 数据格式： | YY-MM-DD-dd |
| 接口： | 并联 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 32-DIP 模块（0.600"，15.24mm） |
| 供应商设备封装： | 32-EDIP |
| 包装： | 管件 |
DS1386/1386P
15 of 21
NOTES:
1)
WE is high for a read cycle.
2)
OE = VIH or VIL. If OE = VIH during write cycle, the output buffers remain in a high impedance state.
3) tWP is specified as the logical AND of the CE and WE. tWP is measured from the latter of CE or WE
going low to the earlier of
CE or WE going high.
4) tDS or tDH are measured from the earlier of CE or WE going high.
5) tDH is measured from WE going high. If CE is used to terminate the write cycle, then tDH = 20ns for
-120 parts and tDH = 25ns for -150 parts.
6) If the
CE low transition occurs simultaneously with or later than the WE low transition in write cycle
1, the output buffers remain in a high impedance state during this period.
7) If the
CE high transition occurs prior to or simultaneously with the WE high transition, the output
buffers remain in a high impedance state during this period.
8) If
WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition,
the output buffers remain in a high impedance state during this period.
9) Each DS1386 is marked with a four-digit date code AABB. AA designates the year of manufacture.
BB designates the week of manufacture. The expected tDR is defined for DIP modules as starting at
the date of manufacture.
10) All voltages are referenced to ground.
11) Applies to both interrupt pins when the alarms are set to pulse.
12) Interrupt output occurs within 100ns on the alarm condition existing.
13) Both
INTA and INTB (INTB) are open-drain outputs.
14) Real-Time Clock modules (DIP) can be successfully processed through conventional wave-soldering
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85°C. Post solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap module bases experience one pass through
solder reflow oriented with the label side up (“live-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| DS1386-8-120+ | 功能描述:实时时钟 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1386-8-150 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| DS1386-8K | 制造商:Maxim Integrated Products 功能描述: |
| DS1386P | 制造商:DALLAS 制造商全称:Dallas Semiconductor 功能描述:RAMified Watchdog Timekeeper |
| DS1386P08-120 | 制造商:DALLAS 制造商全称:Dallas Semiconductor 功能描述:RAMified Watchdog Timekeeper |
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