参数资料
型号: DS1553WP-150+
厂商: Maxim Integrated Products
文件页数: 10/20页
文件大小: 0K
描述: IC RTC RAM Y2K 3.3V 150NS 34PCM
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 40
类型: 时钟/日历
特点: 警报器,闰年,NVSRAM,监视计时器,Y2K
存储容量: 8KB
时间格式: HH:MM:SS(24 小时)
数据格式: YY-MM-DD-dd
接口: 并联
电源电压: 2.97 V ~ 3.63 V
电压 - 电源,电池: 3V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 34-PowerCap? 模块
供应商设备封装: 34-PowerCap 模块
包装: 管件
DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM
18 of 20
AC TEST CONDITIONS
Output Load: 100 pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) Voltage referenced to ground.
2) Typical values are at +25
C and nominal supplies.
3) Outputs are open.
4) Battery switch over occurs at the lower of either the battery voltage or VPF.
5) The IRQ /FT and RST outputs are open drain.
6) Data retention time is at +25
C.
7) Each DS1553 has a built-in switch that disconnects the lithium source until VCC is first applied by the
user. The expected tDR is defined for DIP modules as a cumulative time in the absence of VCC starting
from the time power is first applied by the user.
8) Real-time clock modules (DIP) can be successfully processed through conventional wave-soldering
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85
C. Post solder cleaning with water-washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap:
a. Maxim recommends that PowerCap Module bases experience one pass through solder reflow
oriented with the label side up (“live-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to
remove solder.
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