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参数资料
| 型号： | DS1556WP-120IND |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 9/18页 |
| 文件大小： | 0K |
| 描述： | IC RTC RAM Y2K 3.3V 120NS 34PCM |
| 标准包装： | 40 |
| 类型： | 时钟/日历 |
| 特点： | 警报器，闰年，NVSRAM，监视计时器，Y2K |
| 存储容量： | 128KB |
| 时间格式： | HH:MM:SS（24 小时） |
| 数据格式： | YY-MM-DD-dd |
| 接口： | 并联 |
| 电源电压： | 2.97 V ~ 3.63 V |
| 电压 - 电源，电池： | 3V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 34-PowerCap? 模块 |
| 供应商设备封装： | 34-PowerCap 模块 |
| 包装： | 管件 |
DS1556 1M, Nonvolatile, Y2K-Compliant Timekeeping RAM
17 of 18
AC TEST CONDITIONS
Output Load: 50 pF + 1TTL Gate
Input Pulse Levels:
0.0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5 ns
NOTES:
1. Voltage referenced to ground.
2. Typical values are at +25
C and nominal supplies.
3. Outputs are open.
4. Battery switchover occurs at the lower of either the battery voltage or VPF.
5. The
IRQ/FT and RST outputs are open drain.
6. Data-retention time is at +25
C.
7. Each DS1556 has a built-in switch that disconnects the lithium source until VCC is first applied by the
user. The expected tDR is defined for DIP modules and PowerCap modules as a cumulative time in the
absence of VCC starting from the time power is first applied by the user.
8. RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques
as long as temperature exposure to the lithium energy source contained within does not exceed
+85
C. Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic
vibration is not used.
In addition, for the PowerCap:
a. Maxim recommends that PowerCap Module bases experience one pass through solder reflow
oriented with the label side up (“live-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to
remove solder.
9. tAH1, tDH1 are measured from WE going high.
10. tAH2, tDH2 are measured from CE going high.
11. tWC = 200ns.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-”
in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND PATTERN NO.
32 EDIP
MDF32+1
—
34 PWRCP
PC2+6
—
相关PDF资料 |
PDF描述 |
|---|---|
| DS1557P-70IND | IC RTC RAM Y2K 5V 70NS 34PCM |
| DS1558Y-TRL | IC RTC W/NV RAM 5V 48-TQFP |
| DS1602+ | IC COUNTER ELAPSED TIME 5V 8-DIP |
| DS1603+ | IC COUNTER ELAPSED TIME 5V 7-SIP |
| DS1642-70+ | IC RAM TIMEKEEP NV 70NS 24-EDIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DS1556WP-120IND+ | 功能描述:实时时钟 1M NV RAM Timekeeper RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1557 | 制造商:DALLAS 制造商全称:Dallas Semiconductor 功能描述:4MEG NV Y2KC Timekeeping RAM |
| DS1557P/YP/WP | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:PowerCap with Crystal |
| DS1557P-100 | 制造商:DALLAS 制造商全称:Dallas Semiconductor 功能描述:4MEG NV Y2KC Timekeeping RAM |
| DS1557P-70 | 功能描述:实时时钟 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
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