参数资料
型号: DS1643P-70+
厂商: Maxim Integrated Products
文件页数: 4/17页
文件大小: 0K
描述: IC RAM TIMEKEEP NV 70NS 34-PCM
标准包装: 40
类型: 时钟/日历
特点: 闰年,NVSRAM
存储容量: 8KB
时间格式: HH:MM:SS(24 小时)
数据格式: YY-MM-DD-dd
接口: 并联
电源电压: 4.5 V ~ 5.5 V
电压 - 电源,电池: 3V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 34-PowerCap? 模块
供应商设备封装: 34-PowerCap 模块
包装: 管件
DS1643/DS1643P
12 of 17
AC TEST CONDITIONS
Output Load: 100pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) Voltages are referenced to ground.
2) Typical values are at +25
C and nominal supplies.
3) Outputs are open.
4) The CE2 control signal functions exactly the same as the CE signal except that the logic levels for
active and inactive levels are opposite.
5) Data retention time is at 25
C.
6) Each DS1643 has a built-in switch that disconnects the lithium source until VCC is first applied by the
user. The expected tDR is defined for DIP modules as a cumulative time in the absence of VCC starting
from the time power is first applied by the user.
7) Real-Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85
C. Post-solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“live-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To
remove the part, apply flux, heat the lead frame pad until the solder reflow and use a solder
wick to remove solder.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a
different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
28 EDIP
MDF28+2
34 PowerCap
PC1+2
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DS1643P-70+ 功能描述:实时时钟 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
DS1643P-85 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Nonvolatile Timekeeping RAMs
DS1643P-85+ 功能描述:实时时钟 NV Timekeeping RAM RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
DS1644 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Nonvolatile Timekeeping RAM
DS1644+120 制造商:DALLAS 制造商全称:Dallas Semiconductor 功能描述:Nonvolatile Timekeeping RAM