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参数资料
| 型号： | DS1744-70+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 7/16页 |
| 文件大小： | 0K |
| 描述： | IC RTC RAM Y2K 5V 70NS 28-EDIP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 12 |
| 类型： | 时钟/日历 |
| 特点： | 闰年，NVSRAM，Y2K |
| 存储容量： | 32KB |
| 时间格式： | HH:MM:SS（24 小时） |
| 数据格式： | YY-MM-DD-dd |
| 接口： | 并联 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 28-DIP 模块（0.600"，15.24mm） |
| 供应商设备封装： | 28-EDIP |
| 包装： | 管件 |
| 产品目录页面： | 1434 (CN2011-ZH PDF) |
DS1744/DS1744P Y2K-Compliant, Nonvolatile Timekeeping RAMs
15 of 16
AC TEST CONDITIONS
Output Load: 50pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) Voltages are referenced to ground.
2) Typical values are at +25°C and nominal supplies.
3) Outputs are open.
4) Battery switchover occurs at the lower of either the battery terminal voltage or VPF.
5) Data-retention time is at +25°C.
6) Each DS1744 has a built-in switch that disconnects the lithium source until the user first applies VCC.
The expected tDR is defined for DIP modules and assembled PowerCap modules as a cumulative time
in the absence of VCC starting from the time power is first applied by the user.
7) RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques as
long as temperature exposure to the lithium energy source contained within does not exceed +85°C.
Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic vibration is
not used.
In addition, for the PowerCap:
a.) Maxim recommends that PowerCap module bases experience one pass through solder reflow
oriented with the label side up (“live-bug”).
b.) Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3
seconds. To solder, apply flux to the pad, heat the lead frame pad, and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows, and use a solder wick to
remove solder.
8) tAH1, tDH1 are measured from WE going high.
9) tAH2, tDH2 are measured from CE going high.
10) tWC = 200ns.
PACKAGE INFORMATION
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix
character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND PATTERN NO.
28 EDIP
MDF28+3
—
34 PWRCP
PC2+2
—
相关PDF资料 |
PDF描述 |
|---|---|
| DS1744WP-120+ | IC RTC RAM Y2K 3.3V 120NS 34-PCM |
| VI-B21-MY-F2 | CONVERTER MOD DC/DC 12V 50W |
| VI-B21-MY-F1 | CONVERTER MOD DC/DC 12V 50W |
| VI-23Z-MY-F3 | CONVERTER MOD DC/DC 2V 20W |
| DS1557WP-120+ | IC RTC RAM Y2K 3.3V 120NS 34PCM |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DS1744-70+ | 功能描述:实时时钟 Timekeeping NV RAM RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1744-70IND | 功能描述:实时时钟 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1744-70IND/C01 | 功能描述:实时时钟 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1744-70IND+ | 功能描述:实时时钟 Timekeeping NV RAM RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1744P | 制造商:DALLAS 制造商全称:Dallas Semiconductor 功能描述:Y2K-Compliant, Nonvolatile Timekeeping RAMs |
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