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参数资料
| 型号： | DS1746-70+ |
| 厂商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分类： | XO, clock |
| 英文描述： | Y2K-Compliant, Nonvolatile Timekeeping RAMs |
| 中文描述： | REAL TIME CLOCK, PDIP32 |
| 封装： | 0.740 INCH, ROHS COMPLIANT, EDIP-32 |
| 文件页数： | 7/16页 |
| 文件大小： | 140K |
| 代理商： | DS1746-70+ |
DS1746/DS1746P Y2K-Compliant, Nonvolatile Timekeeping RAMs
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AC TEST CONDITIONS
Output Load: 50pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) Voltages are referenced to ground.
2) Typical values are at +25
C and nominal supplies.
3) Outputs are open.
4) Battery switchover occurs at the lower of either the battery terminal voltage or VPF.
5) Data-retention time is at +25
C.
6) Each DS1746 has a built-in switch that disconnects the lithium source until VCC is first applied by the
user. The expected tDR is defined for DIP modules and assembled PowerCap modules as a cumulative
time in the absence of VCC starting from the time power is first applied by the user.
7) RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques
as long as temperatures as long as temperature exposure to the lithium energy source contained within
does not exceed +85
C. Post-solder cleaning with water-washing techniques is acceptable, provided
that ultra-sonic vibration is not used.
In addition, for the PowerCap:
a) Maxim recommends that PowerCap module bases experience one pass through solder reflow
oriented with the label side up (“live-bug”).
b) Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad, and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows, and use a solder wick to
remove solder.
8) tWR1, tDH1 are measured from WE going high.
9) tWR2, tDH2 are measured from CE going high.
10) tWC = 200ns.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-”
in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
LAND PATTERN NO.
32 EDIP
MDF32+1
—
34 PWRCP
PC2+6
—
相关PDF资料 |
PDF描述 |
|---|---|
| DS1746-70IND+ | Y2K-Compliant, Nonvolatile Timekeeping RAMs |
| DS1746P-70+ | Y2K-Compliant, Nonvolatile Timekeeping RAMs |
| DS1746P-70IND+ | Y2K-Compliant, Nonvolatile Timekeeping RAMs |
| DS1746W-120+ | Y2K-Compliant, Nonvolatile Timekeeping RAMs |
| DS1746W-120IND+ | Y2K-Compliant, Nonvolatile Timekeeping RAMs |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DS1746-70+ | 功能描述:实时时钟 Timekeeping NV RAM RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1746-70IND | 功能描述:实时时钟 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1746-70IND+ | 功能描述:实时时钟 Timekeeping NV RAM RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1746P | 制造商:DALLAS 制造商全称:Dallas Semiconductor 功能描述:Y2K-Compliant, Nonvolatile Timekeeping RAMs |
| DS1746P/YP/WP | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:PowerCap with Crystal |
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